iNEMI Member Meeting (Japan) January 2018
Tokyo, Japan | January 22, 2018
Monday, February 19, 2018
Section: Presentations, Webinars, & Reports
Agenda and Introduction
The Members’ Meeting in Japan was held on January 22, 2018, hosted by Dow Chemical. Eighteen people attended the meeting (even though it was a snow day). Two members talks were given:
iNEMI project status was presented to the members by Masahiro Tsuriya (iNEMI):
Contact Masahiro Tsuriya for more information.
- Advanced Package Technologies Trend; Rozalia Beica, Dow Chemical
Presentation included the market drivers and trend and advanced package technology overviews with FI/FO-WLP package evolution.
- Plate on Film Technology Overview; Hideaki Maeda, Rohm & Haas Electronic Materials K.K.
Presentation included the metal mesh technology for potential market application and plating technical challenges.