Advancing Manufacturing Technology

iNEMI Member Meeting (Japan) January 2018
Tokyo, Japan | January 22, 2018
Monday, February 19, 2018
Section: Presentations, Webinars, & Reports




Agenda and Introduction

The Members’ Meeting in Japan was held on January 22, 2018, hosted by Dow Chemical.  Eighteen people attended the meeting (even though it was a snow day). Two members talks were given:
 
  • Advanced Package Technologies Trend; Rozalia Beica, Dow Chemical
    Presentation included the market drivers and trend and advanced package technology overviews with FI/FO-WLP package evolution.
     
  • Plate on Film Technology Overview; Hideaki Maeda, Rohm & Haas Electronic Materials K.K.
    Presentation included the metal mesh technology for potential market application and plating technical challenges.
iNEMI project status was presented to the members by Masahiro Tsuriya (iNEMI):
 
Contact Masahiro Tsuriya for more information.