Advancing Manufacturing Technology

October 2018 Newsletter
Monday, October 1, 2018
Section: Monthly Newsletters




October 2018
For iNEMI Members Only
MESSAGE FROM THE CEO: iNEMI HEADQUARTERS IS MOVING TO NORTH CAROLINA
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iNEMI is moving our headquarters from Herndon, Virginia U.S. (outside of Washington, D.C.) to the Raleigh, North Carolina U.S. area. This move was triggered by external forces — our office building has been put up for sale and all office leases are being terminated by December 31, 2018. With the guidance and oversight of the iNEMI Board of Directors, we explored several options for a new location. The pros and cons of multiple attributes were assessed, including proximity to members, academia, transportation, etc. In the end, the Greater Raleigh/ Research Triangle Park (RTP) area reached the top of the list in terms of meeting our needs. We have since identified office space and are in the final stages of signing a lease. 

Our plan is to transition operations from Herndon to Raleigh over the October/November timeframe, closing the Herndon office by the end of November and beginning full operations in Raleigh by December 1. Unfortunately, office closures can have an impact on personnel, and our Herndon-based staff are being impacted by the move. This is truly unfortunate, and we thank them for the many years of service to iNEMI and its members.

We will keep you fully informed on the transition from Herndon to Raleigh, including details about the new office location and contact information, so please watch for subsequent notices. If anyone has any questions, please don’t hesitate to reach out to me (Marc Benowitz) at marc.benowitz@inemi.org.

DEADLINE FOR DUES DISCOUNT IS OCTOBER 31
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There is still time to save on iNEMI membership dues. Pay for 2019 dues by October 31, 2018, and save 5%. Pay for 2020 and save 10%. Details are available here. Please contact Linda Anderson-Jessup, iNEMI Membership Manager, if you would like to take advantage of the discounts.
iNEMI AT FALL CONFERENCES
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North America: SMTA International
October 14-18; Rosemont, Illinois
Check out the iNEMI project presentations at SMTA International in Rosemont, Illinois (October 14-18). Seven presentations and panel discussions will discuss iNEMI projects and the roadmap in sessions on harsh environments, Smart Manufacturing/Industry 4.0, advanced packaging and lead-free alloys. Here’s a schedule of presentations

In addition, iNEMI CEO Marc Benowitz and Vice President Grace O’Malley are attending the conference and are available for meetings. Let them know if you’d like to get together while you’re there.
 

Asia: 2018 IMPACT
October 24-26; Taipei
iNEMI is a co-organizer of the 2018 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference in Taiwan. Haley Fu, iNEMI’s Managing Director of Asia Pacific, will be attending this conference, so email her at haley.fu@inemi.org if you plan to be there and would like to meet.

Europe: Going Green – CARE INNOVATION
November 26-29; Vienna
We have two presentations at this year’s CARE INNOVATION conference. Both are part of the Circularity Evaluations Session (Wednesday, November 28; 11:00-13:00; Room 8 — Sophie). The papers are: “Application of the Ostrom Framework to Support a Circular Economy for Used Electronics” and “A Practical Means for Assessing Circular Economic Value of an ICT Product.” Get additional conference details

iNEMI Presentations at SMTA International 2018 (Rosemont, Illinois, USA) – October 15-18
Call for Participation: Eco-Impact Estimator, Phase 3 – October 17
IPSR Webinar: Highlights of the World Technology Mapping Forum – October 18

Call for Participation: Test, Inspection & Measurement TIG – October 23/24

2018 IMPACT (Taiwan) – October 24-26
End-of-Project Webinar: Value Recovery from Used Electronics, Phase 2 – October 31 & November 2
End-of-Project Webinar: Connector Reliability Test Recommendations, Phase 2 – November 14/15
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PCB Chat podcast, Marc Benowitz (iNEMI), Episode 22 (September 7, 2018)
Article: Trends in Medical Device TechnologyNext-generation devices will rely on 3-D interconnect technology and power “scavenging,” Donald Banks (Abbott), PCD&F/CA, September 2018, Digital Edition
Webinar Presentation: Creep Corrosion Test Using iNEMI FoS Chamber - September 25/26
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New Projects Forming
 

Call for Participation Webinar: Eco-Impact Estimator, Phase 3

Wednesday, October 17
2:00-3:00 p.m. EDT (U.S.)

The iNEMI Eco-Impact Estimator currently enables life cycle assessment (LCA) for two categories of ICT components: bare printed wiring boards and large integrated circuits. It provides extremely accurate and efficient estimates by mitigating the major obstacles of performing an LCA — complexity, skill required, expense and time.

We are organizing Phase 3 of the Eco-Impact Estimator project to further leverage and expand the tool/framework. Proposals for enhancing current capabilities include: (1) updating and expanding the scope of ICT components covered and (2) investigating inclusion of other environmental aspects such as energy and water usage. Join us for this open industry webinar to discuss plans for this new project. Additional details and registration.

Call for Participation: Test, Inspection & Measurement TIG
October 23/24
iNEMI members only
iNEMI Technology Integration Groups (TIGs) give all iNEMI members an opportunity to influence the selection and direction of projects in their particular technology areas of interest. The goal of this webinar is to start the process of identifying and defining iNEMI collaborative programs in the area of test, inspection and measurement to address industry needs and member interests. This meeting will (1) review and identify key gaps and challenges in the near and mid-term, with input from industry and the iNEMI Technical Plan; and (2) propose and prioritize candidate projects to be addressed in a cross-industry/academic collaborative approach. Click here for details & registration. 

Call for Participation Webinar: Packaging TIG
November 8 & 9
iNEMI members only
The iNEMI Packaging TIG is holding a webinar for members to discuss and define areas we should focus on for developing new collaborative projects. This meeting is an opportunity for you and your organization to help influence the selection and direction of packaging projects. As with the Test, Inspection & Measurement TIG meeting (mentioned above) this webinar will review and identify key gaps and challenges in the near and mid-term, and propose and prioritize candidate projects. Get additional details.
End-of-Project Webinars
 

Value Recovery from Used Electronics
October 31 & November 2
Phase 2 of iNEMI’s Value Recovery from Used Electronics project addressed hard disk drive design, reuse, remanufacturing, and materials and component recovery to enable a robust, sustainable circular supply economy for hard disk drives (HDDs). In this end-of-project webinar, the team will review results, including five demonstration projects to show how used hard drives can be turned into new hard drives. These webinars are open to non-members as well as iNEMI members. Make plans to join us — click here for additional project information and webinar registration.

Connector Reliability Test Recommendations
November 14 & 15
The first phase of iNEMI’s Connector Reliability Test Recommendations Project reviewed current standards pertaining to connector reliability and surveyed industry to determine common metrics for connector reliability guidelines. In Phase 2, the project team defined specific test conditions to be used to evaluate the expected degradation of connectors used under different stress levels in specific application classes. This work could form the basis for standardized reliability test procedures for each application class. The project team will review Phase 2 results in this end-of-project webinar. For additional information.
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IPSR Update
Webinar Scheduled to Review Highlights of the World Technology Mapping Forum


Prof. Backx, President of the Institute for Photonic Integration at Eindhoven University of Technology and of PhotonDelta, will review highlights from the World Technology Mapping Forum (WTMF) held this past June in The Netherlands. This meeting, which provided a high-level technical discussion between research and industry leaders, focused on creating the first global integrated photonics systems roadmap.

Technology roadmaps create a shared vision of the future and guide progress toward that vision. This kind of planning is essential for government, research and industry to identify the crucial technologies and make the necessary strategic investments for decades ahead. It provides a much-needed global discussion of “real-world” needs for specific technologies.

Click here for additional webinar information.

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