iNEMI is pleased to welcome Silicon Valley X-Ray Inc. (SVXR). The first representative is David Adler; and the alternate representative is Marco Guevremont. SVXR provides an inline inspection and metrology system that allows manufacturers of advanced interconnects to quickly bring the products to market at high yields and high reliability. Their system provides higher sensitivity to defects, higher throughput, faster inspection speed, enormous field of view, uniform imaging capabilities, and lower noise flow.
Q2 MEMBER UPDATE WEBINAR (May 9)
Plan to join us for the quarterly member update on May 9. The Asia session is scheduled for 9:00 a.m. CST (China) and the North America/Europe session is scheduled for 10:00 a.m. EDT (US) / 3:00 p.m. BST (Europe). This meeting is for iNEMI members only, and registration is required.
This webinar will bring you up to date on the latest information from iNEMI, including results of the Board of Directors election. Additional presentations will cover:
Highlights from the Internet of Things product sector chapter of the 2017 iNEMI Roadmap
This project, which is currently in sign-up, proposes to design, assemble and test a prototype on-board fiber optic interconnection system based on silicon photonic transceiver modules, single-mode fiber cables, and expanded-beam optical connectors for the package, backplane, and front-plane interfaces. Existing technologies will be leveraged wherever possible. This project will comprise Phase 1; the second phase will investigate the use of PCB-embedded waveguides to replace fly-over fiber cables.
Presentations: iNEMI & CDCC Workshop: Corrosion in Data and Telecom Centers (April 24, 2017; Shanghai, China)
Presentation: Highlights of the Passives Chapter from the 2017 iNEMI Roadmap, Chuck Richardson (iNEMI), Electronic Components Industry Association (ECIA) Spring Engineering Summit (May 3, 2017; Herndon, Virginia)
All 28 of the 2017 Roadmap chapters are now available online for members, including the final remaining chapter (Information Management) as well as the complete compilation roadmap. The process for non-member purchase is also now in place on the iNEMI website. This is the largest and most complete roadmap ever so be sure to check out these latest additions. Many thanks to all those who contributed or reviewed chapters during the development of this important information source for our industry. If you have any problems accessing the roadmap, please contact Dee-Dee Taylor.
TIGs Developing iNEMI Technology Plan
Meeting Scheduled at ECTC
Four of the seven Technology Integration Groups (TIGs) identified for this cycle are up and holding meetings in preparation for the status review meeting at ECTC on May 30 in Orlando, Florida. The iNEMI Technology Integration Groups (TIGs) lead the development of the iNEMI Technical Plan in specific technical areas, and support and drive the deployment agenda through collaborative projects. There are presently seven TIGs: Board Assembly, Sustainable Electronics, Medical Electronics, Optoelectronics, Printed Circuit Boards, Substrates/Packaging and Test.
We still need leaders and participants for three important TIGs: Sustainable Electronics, Medical Electronics and Test. If someone in your company would like to be involved in helping lead and/or participate in the development of the 2017 iNEMI Technology Plan, please contact Chuck Richardson. The technology plans are one key element in project planning for the next two to five years, so please support this important effort.
In addition to the TIG review meeting, we will also be holding iNEMI Technical Committee and Research Committee meetings on May 30. Any interested members are welcome to attend these meetings in person if you are at ECTC. For further details please contact Grace O’Malley.
iNEMI 2214 Rock Hill Road Suite 110 Herndon VA 20170-4214 USA