Advancing Manufacturing Technology

July 2017 Newsletter
Saturday, July 1, 2017
Section: Monthly Newsletters




July 2017
For iNEMI Members Only
iNEMI MEMBER MEETING IN TOKYO
thumb
iNEMI is holding a member meeting in Tokyo on August 4. The event, hosted by iNEMI member Takaoka Toko, will feature presentations from select member companies regarding their respective technologies and include discussion of the latest iNEMI activities. Get additional information.
QUARTERLY MEMBER UPDATE IS AUGUST 29
thumb

The Q3 iNEMI Members’ Update is scheduled for August 29 and will be accomplished with two separate webinars. The Asia webinar is scheduled for 9:00-10:00 a.m. CST (China); and the North America/Europe webinar is 10:00-11:00 a.m. EDT (North America) / 4:00-5:00 p.m. CEST (Central Europe).  Registration is required, so be sure to register early. A one-hour webinar is scheduled for each session and will focus primarily on packaging issues with presentations from the 2017 Packaging & Component Substrates TIG and reports from packaging-related iNEMI projects. For more information.

WILLIAM CHEN RECEIVES IEEE AWARD
thumb

William Chen (ASE) is the 2018 recipient of the IEEE Components, Packaging and Manufacturing Technology Award, sponsored by the IEEE Electronics Packaging Society.  The organization recognized him “for contributions to electronic packaging from research and development through industrialization, and for his leadership in strategic roadmapping efforts.” 

Bill is an ASE Fellow and Senior Technical Advisor for iNEMI member ASE. He has served on the iNEMI Board of Directors since 2012, and co-chairs the Packaging & Components Substrates Technology Working Group (TWG) of the iNEMI Roadmap. Congratulations on your well-deserved recognition, Bill!

SURVEY TO ASSESS MEASUREMENT/METROLOGY FOR POLYMER OUTGASSING
thumb
iNEMI is conducting an industry-wide survey to assess the measurement/metrology for polymer outgassing. We ask for your participation in this survey to help us understand the current situation and identify future direction of the metrology in the industry.  Only aggregated data will be reported from this survey, and results will be shared through an iNEMI webinar. Take the survey
Call-for-Participation Webinar: Warpage Characteristics of Organic Packages, Phase 4 – July 27 & 28
Q3 iNEMI Member Update Webinar – August 28 & 29
End-of-Project Webinar: Electronic Materials for Automotive Harsh Environments — September 7
iNEMI at SMTAI – September 17-21 (Rosemont, Illinois USA)
iNEMI Session at 2017 IMPACT — October 27 (Taipei, Taiwan)
event_calendar
FUTURECAR copy.png
 
FEATURED NEWS & CONTENT

Presentation: “A Vision for the Circular Economy in Hard Disk Drives Based on Self-Management of Common Pool Resources,” presented by Colin Fitzpatrick (University of Limerick), at ISIE-ISSST (June 29; Chicago). 

Presentation: iNEMI Roadmap 2017, presented by Alan Rae (IncubatorWorks) at the International Conference on Soldering & Reliability (Toronto; June 7).  

 

NEW FROM THE iNEMI BLOG

Mass Data Storage Roadmap Points to Further Growth in NAND as well as HDD, Tape and Optical Technologies, by Roger F. Hoyt, consultant.

 
thumb04_w.jpg
Three New Projects in Sign-Up
 

New Packaging Technology Qualification Methodology (Sign up by August 15)
This project plans to develop a methodology that will address the gaps in current standards and standard practices for package qualification. See the website for presentations from the call-for-participation webinars held July 10 and 11. 

PCB Warpage Characterization and Minimization Project (Sign up by July 15)
This project will explore three areas — PCB fabrication process, PCB design, and board assembly process conditions — and develop guidelines for each of these factors to help minimize PCB warpage and improve SMT margins/yields. See the website for presentations from the call-for-participation webinars on June 14 and 15.

Warpage Characteristics of Organic Packages, Phase 4
Call-for-Participation Webinars:
July 27 & 28
 (Sign up by August 18)
The goal of this project is to understand the kind of dynamic warpage that is demonstrated in industry. The project is a follow-on to previous phases that have addressed metrology challenges and recent trends in package warpage characteristics. More information.

End-of-Project Webinar: Electronic Materials for Automotive Harsh Environments
 
This project addressed the issue that automotive electronics used in harsh environments lack unified and accepted material standards. It was organized to identify common failure mechanisms and determine how standards can relate to each. Project plans also included definition of a suite of tests to give a high degree of confidence in meeting OEM requirements.

Two sessions are scheduled on September 7 to review results of this project. The webinar is open to non-members. Details and registration.
thumb04_w.jpg
TIGS Continue Work on iNEMI Technical Plan
 
Six of iNEMI's seven Technology Integration Groups (TIGs) are now engaged in developing their technology plans for 2017. These plans propose projects that: (1) address gaps identified as critical in the 2017 iNEMI Roadmap, (2) fit within the iNEMI scope of interest, and (3) have member support on the TIGs.

We are still in need of a leader and participants for the Medical Electronics TIG. If anyone in your company would like to help lead and/or participate in the Medical TIG — or any of the other TIGs — to develop the 2017 iNEMI Technical Plan, please contact Chuck Richardson. The Technical Plan is a key element in planning iNEMI projects for the next two to five years, so please support this important effort.
iNEMI   2214 Rock Hill Road  Suite 110  Herndon  VA   20170-4214   USA