Advancing Manufacturing Technology

February 2018 Newsletter
Thursday, February 1, 2018
Section: Monthly Newsletters




February 2018
For iNEMI Members Only
MESSAGE FROM THE NEW CEO
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It is an honor and a privilege to serve you as iNEMI's fourth CEO. I am excited about how we, as an industry working together, can address the challenges and opportunities that face us. iNEMI’s history, under the leadership of my predecessors, has repeatedly shown that industry collaboration can accomplish amazing feats. Leveraging the expertise you all bring to a project has demonstrated we can create a virtual vertically integrated team, where we truly complement each other, and are able to address common gaps for our industry. It continues to be an exciting time for the electronics manufacturing industry, with no shortage of hot topics for our attention. I will personally be reaching out to all members to introduce myself and listening to your ideas/thoughts on what our priorities should be and how we can collectively address them.

With best regards for many fruitful collaborations,
Marc (marc.benowitz@inemi.org)
JOIN US AT APEX: 2019 ROADMAP MEETING (February 25 & 26)
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Join us for the PEG Workshop/TWG Kick-off meeting at APEX in San Diego on February 25 and 26. The meeting will be held in Room 5B of the convention center and is open to anyone who is interested.

Expected outcomes:

  • Share PEG progress and get first impressions from the TWG teams
  • Gather early feedback from APEX “walk-ins”

Register now.

Unable to attend in person? WebEx will be available during the general sessions on each day. Click on the dates below to register for the Webex session:

KULICKE & SOFFA IS NEWEST iNEMI MEMBER
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iNEMI is pleased to welcome Kulicke & Soffa Netherlands B.V. The first representative is Peter van Hoogstraten; and the alternate representative is Marco van Oosterhout. K&S is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments.
iNEMI AT CONFERENCES IN ASIA, EUROPE & U.S.
Meetings in Europe

ICEP-IAAC 2018 (April 17-21; Kuwana, Mie, Japan): An iNEMI session at ICEP-IAAC (April 19) will feature four presentations from iNEMI projects. Two papers are from the SiP Moldability project, one is from the BiSn-Based Low-Temperature Solder project and the fourth is from the Inspection Capability of AXI for HiP Defects project. 

OFC 2018 (March 11-15; San Diego, CA): The iNEMI Optoelectronics Technology Integration Group (TIG), together with the AIM Photonics Academy, have scheduled a full-day session on March 12 at the OFC 2018 conference. All meetings are open to anyone interested in attending. iNEMI will review findings and results from its optoelectronics projects; and the AIM Photonics Academy will provide an overview of accomplishments and findings from the Integrated Photonic Systems Roadmap (IPSR), report on projects, and discuss plans for 2018. Get additional information.

Electronics in Harsh Environments Conference
(April 24-26; Amsterdam): This conference, sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. iNEMI is co-organizing the final conference session, which will focus on reliability in the automotive sector. Learn more online or contact Steve Payne (iNEMI) with questions or comments. 

Call for Participation: iNEMI-IPSR Board-Level Optical Interconnect, Phase 2 (Expanded-Beam Module Interface) – February 21 & 22
2019 iNEMI Roadmap PEG Workshop & TWG Kick-off at APEX – February 25 & 26 (San Diego, California)
iNEMI and AIM Academy Meetings at OFC 2018 – March 12 (San Diego)
iNEMI Session at ICEP-IAAC 2018 – April 19 (Kuwana, Mie, Japan)
NEPCON China 2018 – April 24-26 (Shanghai)
Electronics in Harsh Environments Conference – April 24-26 (Amsterdam)
Medical Electronics Symposium – May 16-17 (Dallas, Texas)
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Future PCB fabrication and material requirements for the global industry segments,” presented by Steve Payne, EIPC 2018 Winter Conference (Lyon, France; February 2) 
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New Initiatives Forming
 

iNEMI-IPSR Board-Level Optical Interconnect, Phase 2 (Expanded-Beam Module Interface)

Phase 2 of this project will consist of specifying, designing, modeling, building and demonstrating a board-level optical interconnect system in which an expanded-beam optical connector interface will be developed for the chip module.  Call for participation webinars are scheduled for February 21 & 22. Additional information.

PCBA Cleanliness

The objective of the project will be to predict and understand functional performance of highly dense electronics in harsh environments through measurement of electrical and chemical effects under bottom terminated components. 

GE and Kyzen are leading the development of the statement of work (SOW). We are seeking additional organizations to provide input into the scope of work. A call for participation webinar will be held on February 19.  Please contact Mark Schaffer if you would like more information or want to participate in development of the SOW. Additional information.

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Smart Manufacturing Update
 

Smart Manufacturing (Industry 4.0) content will be new to the 2019 Roadmap, either as part of the IoT PEG or as a stand-alone TWG. There will be a meeting the week of APEX to discuss the structure of the roadmap chapter and potential activities and projects for iNEMI in this area. 

Be a Part of the Effort
 

Participating in the roadmap is open to all subject matter experts who have the expertise and are willing to commit a couple of hours a month to develop content with other team members, attend our roadmap meetings and webinars, and volunteer to write or review the team reports in a few months.

See a list of current PEGs and TWGs, plus the roles and requirements for roadmap team participants. We are actively recruiting for the following teams:

  • Consumer & Office Systems PEG (Chair & Co-Chair)
  • Portable & Wireless PEG (Chair & Co-Chair)
  • Automotive PEG (Chair & Co-Chair)
  • IoT & Wearables PEG (Chair)
  • RF Components & Subsystems TWG (Chair & Co-Chair)
If you’re interested in getting involved in a PEG or TWG — either as a chair/co-chair or as a contributor — please contact Linda Wilson.
2214 Rock Hill Road  Suite 110  Herndon  VA   20170-4214   USA