Make plans to join us for the 2017 iNEMI Roadmap webinar. Two sessions are scheduled — April 6 & 7 — and will provide an overview of the latest roadmap along with highlights from a few key chapters. Registration is required.
If you haven’t gotten your copy of the new roadmap yet, be sure to check it out. Most of the chapters are now available to members for download on the website. The roadmap will go on sale to industry in early April.
GET INVOLVED: iNEMI TIGS & TECHNICAL PLAN
With the completion of the 2017 Roadmap, we now move into the roadmap analysis phase. iNEMI’s Technology Implementation Groups (TIGs) lead the development of the iNEMI Technical Plan, which focuses on identifying the key gaps and challenges between present industry capabilities and future industry needs as forecast by the roadmap. They define the areas that would benefit from a cross-industry collaborative approach over the next three to five years.
We presently have seven TIGs: Board Assembly, Sustainable Electronics (SE), Medical Electronics, Optoelectronics, Printed Circuit Boards (PCBs), Component Substrates/Packaging, and Test. We will use the results of their analyses of the roadmap over the next five months to identify potential projects that can be addressed by, and benefit, the iNEMI membership.
The TIG members are drawn from the pool of technical leadership within the iNEMI member organizations. All iNEMI members can get involved and participation will help your organization identify the projects that are of greatest benefit to you. In particular, we would like to get chairs for the Board Assembly, SE and PCB TIGs. For more information about the role and commitment, or to sign up, please contact Chuck Richardson.
In addition to our own roadmap, iNEMI has played a leadership role in development of the 2016 Integrated Photonic Systems Roadmap (IPSR), working with MIT’s Microphotonics Center under the American Institute for Manufacturing Integrated Photonics (AIM Photonics). The 2016 edition is significantly enhanced from the 2015 PSMC (Photonic Systems Manufacturing Consortium) Roadmap, with double the number of chapters as well as twice as many contributing individuals and organizations. The 2016 IPSR will be available for download later this month from the IPSR website.
IPSR Consortial Projects
As a result of the roadmap work, IPSR has proposed three consortial projects to develop the technology for board-level optical interconnections. AIM Photonics is supporting these projects to define and develop needed technology to facilitate the emergence of low-cost high-volume integrated silicon photonics manufacturing.
The IPSR Board-Level Interconnect Project, which is being managed by iNEMI and is open to all iNEMI members, is the first of three projects that have been identified as being critical to the widespread implementation of board-level integrated photonic systems. This project plans to design, assemble, and test demonstration prototypes of board-level interconnect systems based on single-mode (SM) fiber, expanded-beam optical coupling, and silicon photonics transceivers. This activity will allow evaluation of existing and developing components, thereby identifying gaps in the technologies needed for practical implementation. The project is being chaired by Molex and is currently in the initiative phase.
The second identified project is a low-cost, high-yield solution for single-mode fiber silicon photonic chip attach; and the third project will develop an enabling technology for manufacturing printed wiring boards with embedded single-mode wave guides compatible with wave division multiplexing. If you would like more information about any of these projects, please contact David Godlewksi.
Fine Pitch Circuit Pattern Inspection & Metrology (February 20/21)
This project was organized to assess measurement and inspection capabilities for fine circuit pattern substrates used in high-bandwidth applications. Phase 1 benchmarked the metrology for fine pitch design on panel sized areas, and the results will be discussed in this end-of-project webinar, along with plans for Phase 2 activities. This meeting is open to industry. Sign up for webinar.
Ultra Low Loss Laminate/PCB (March 7/8)
This initiative is addressing key technology challenges and the measurement capabilities needed to deliver ultra-low loss, high-reliability PCB laminate and board performance.
This webinar will review Phase 1 results, including input collected through an industry survey. The team will also discuss planning for Phase 2. This is a members-only meeting. Details and registration.
High-Temperature, Pb-free Die Attach Material Project (March 22/23)
This project is focused on assessing the processability and reliability of different Pb-free materials available for power semiconductor die-attach applications on leadframe or ceramic substrates that currently use Pb-containing materials. The recently completed Phase 1 benchmarked technology, material availability and processing trends. This webinar will discuss results from that benchmarking study. This meeting is open to industry. Register now.
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