The COMET Group develops and produces high-tech components and systems for materials testing and security inspection, surface treatment and non-contact sterilization based on their three core technologies of x-ray, radio frequency and e-beam. YXLON International, which became a part of the COMET Group in 2007, designs and produces radioscopic and CT inspection systems for a broad variety of industrial applications and fields, including aviation and aerospace, automotive, and the electronics industry.
Autodesk makes software for people who make things. Over 100 million people use Autodesk software like AutoCAD, Revit, Maya, 3ds Max, Fusion 360, SketchBook and more to unlock their creativity and solve important design, business and environmental challenges. Customers include design professionals, engineers and architects, digital artists, students, and hobbyists who design a range of products that include high-performance cars, skyscrapers, smartphones and more.
iNEMI BOARD OF DIRECTOR UPDATES & ELECTION
Three new directors have been appointed to the iNEMI Board to complete the terms of directors who have resigned due to employment changes. These three were voted on at the March 20, 2018, Board of Directors meeting. Richard Coyle (Nokia) replaces Marc Benowitz, who retired from Nokia and is now iNEMI’s CEO. San Wong (GE) replaces Murad Kurwa, who is no longer with GE. Brian Jaeger (Lenovo) replaces Mark Morizio, who has retired from Lenovo. Bios of the three new Board members can be found here.
In addition, one Board position is currently up for re-election. Marie Cole (IBM) joined the iNEMI Board in 2014 as a replacement for a departing director, and was elected to a three-year term in 2015. She has decided to run for another term, and we are asking first and alternate representatives from our Participating Members to vote on her re-election. Please follow the voting instructions in the recent email from Marc Benowitz.
COUNCIL OF MEMBERS MEETING SCHEDULED FOR APRIL 18
This year’s Council of Members meeting will be held as a webinar with a special focus on automotive electronics. In addition to reviewing results of the iNEMI Board of Directors election, and a general update on consortium activities, the agenda will include current issues and future trends in automotive PCBA, highlights from the 2017 Automotive Roadmap Chapter, and discussion of iNEMI activities in automotive electronics (past results and future plans). Additional information and registration.
iNEMI AT CONFERENCES IN ASIA, EUROPE & NORTH AMERICA
ICEP-IAAC 2018 (April 17-21; Kuwana, Mie, Japan) If you plan to attend the ICEP-IAAC conference this month, be sure to join us for the iNEMI session on April 19. This session features presentations from three iNEMI projects: SiP Module Moldability, BiSn-Based Low-Temperature Solder and Inspection Capability of AXI for HiP Defects.
Electronics in Harsh Environments Conference
(April 24-26; Amsterdam)
iNEMI is co-organizing the final session of this conference, which is sponsored by SMTA Europe. The session will focus on reliability in the automotive sector, and includes a panel discussion featuring Dr. Lothar Henneken (Robert Bosch GmbH), Craig Hillman (DfR), and Brook Sandy-Smith (Indium). Learn more online or contact Steve Payne (iNEMI) with questions or comments. Medical Electronics Symposium 2018 (May 16 & 17; Dallas area)
iNEMI, SMTA and MEPTEC have joined forces again to host this international conference focused on advances in electronic technologies and advanced manufacturing. Keynote speakers and topics are: Sensorizing and Connecting Medical Devices (Cory Forbes, CTO, Nypro); Robotic Surgery: Where Are the Opportunities? (Kemp H. Kernstine, Sr., M.D., Ph.D., Division of Thoracic Surgery, UT Southwestern Medical Center); and Sensors for Medical Applications: Unlocking the Value (John Burnes, Director of Implantable Core Teams, Cardiac Patient Monitoring and Diagnostics, Medtronic).
Mold flowability impacts the quality and potential warpage of the wafer/panel for subsequent processes. This project will identify key processing factors that impact flowability, establish factors from flowability that impact warpage, and identify other material factors that impact post mold warpage. Additional information.
PCBA Cleanliness Call for Participation Webinar
April 16 & 17
Current industry standards do not adequately address the cleanliness of residues trapped under bottom-terminated components, leaving OEMs and EMS providers to develop their own guidelines and requirements to assure an acceptable level of cleanliness. The objective of this new project will be to predict and understand functional performance of cleaning single-row QFN component packages (as a representative of low clearance, leadless electronic packages) in harsh environments through measurement of electrical and chemical effects under bottom-terminated components. Additional information.
Value Recovery from Used Electronics, Phase 2 Mid-Term Project Review Webinar
May 9 & 10
There is increasing pressure worldwide for societal transformation from a linear economy – based on the traditional take-make-waste model – to a circular economy. Please join the Value Recovery from Used Electronics Project for a mid-term report for details of how hard drives can be a common pool resource and discuss the future work of the team as they undertake a demonstration project to test the practical application of HDD collection, process and, at a minimum, recovery of rare earth magnets. Additional information.
Roadmap Smart Manufacturing Technology Working Group (TWG)
The Smart Manufacturing TWG has quickly grown to more than 20 members, and we continue to invite participation. The TWG team is now focusing on roadmap topics and sub-team assignments. A key roadmap date is to have content in draft form by the end of May for the Technical Committee/TWG review workshops set for North America, Europe and Asia. Meeting this target will position this very new TWG at the same pace as the other roadmap TWGs for producing a report on time for the 2019 Roadmap. If you are interested in joining this exciting effort, please contact Linda Wilson (iNEMI).
Product Emulator Group (PEG) Progress Update Meetings in May
Our next dates for progress checks are fast approaching, with a PEG webinar review of draft reports on May 22, and the TC review of the TWG response and progress on May 29 (North America), June 7 (Europe), and June 13 (Asia). The webinar information will be posted soon on our iNEMI website. iNEMI members are invited to engage in these interim updates and, most importantly, give your feedback directly to the PEG and TWG teams.
Please Join Us!
Interested in being a roadmap PEG or TWG team member? You will gain immediate benefit by helping to develop projections for the industry and get the earliest possible insight months in advance of the roadmap release. Participating in the roadmap is open to all subject matter experts that have the expertise and are willing to commit a couple of hours a month to develop content with other team members, attend our roadmap meetings and webinars, and volunteer to write or review the team reports in a few months.