Advancing Manufacturing Technology

July 2020 Newsletter
Wednesday, July 1, 2020
Section: Monthly Newsletters




Events and Publications

July 2020

Project Activities

Call for Participation

Package and High Density Interconnect Socket Warpage Call-for-Participation Webinar (APAC session, July 3) — Two new warpage projects are currently in the call-for-participation stage and will be reviewed in this upcoming webinar: (1) Package Warpage Prediction and Characterization and (2) High Density Interconnect Socket Warpage Prediction and Characterization. 

Best Practices for Expanded Beam Connectors in Data Centers Call-for-Participation Webinar (July 7) — Join iNEMI to learn about this project’s plans to develop industry cleanliness guidelines for expanded beam connectors used in data centers. With less sensitivity to contamination and scratches, expanded beam connectors have the potential to reduce costs while maintaining high performance; however, these connectors still require inspection and cleaning to prevent performance degradation. 

Sign Up Now for New Projects — Several new projects are currently in sign-up and have recently held call-for-participation webinars. Click on the links below for additional project details and to access webinar presentations:

End-of-Project Webinars & Reports

New Package/Material Qualification Methodology Project Summary Report — This report details the project team’s recommendations to address identified gaps in current test methods and qualification standards for advanced packaging technologies. These recommendations include the need for extending the current test methods for new and future anticipated use conditions. The report also recommends tools and best practices that should be leveraged to ensure consistency across the supply chain, enabling faster assessment of new materials and, ultimately, more effective and successful qualification of new packaging technologies.

Technology Integration Groups (TIGs)

Technology Integration Group (TIG) Meetings (members only) — The iNEMI TIGs play an important role in identifying key projects for collaboration. TIG participartion is open to all iNEMI member organizations and is an excellent way to help ensure that new projects focus on areas that are relevant to our members' needs. Following is a list of upcoming meetings. If you are interested in getting involved, contact the iNEMI project manager listed. 

Roadmap Activities

iNEMI Roadmap Highlights Webinar Series: Design Technologies (July 8) — The Design Technologies webinar will cover two chapters: Modeling, Simulation & Design Tools and Thermal Management.

iNEMI Roadmap Highlights Webinar Series: Connectors (July 15) — The webinar will cover the highlights from the Connector chapter, discussing recent industry advances and challenges.  

iNEMI Roadmap Highlights Series Presentations — Get the latest presentations from our review of highlights from iNEMI Roadmap chapters. The most recent chapters covered are:

  • Optoelectronics
  • Mass Data Storage
  • High-End Systems

Roadmap Article Series: "High-End Systems Product Needs — SiP, MCP and DDR5 support faster speeds and higher power requirements," Kartik Ananth, Intel, and Dale Becker, IBM; Printed Circuit Design & Fab / Circuits Assembly, June 2020, p. 29.

iNEMI / SMTA Technical Webinar Series

iNEMI/SMTA Technical Webinar Series — iNEMI is co-hosting a series of technical webinars with the Surface Mount Technology Assoication (SMTA). These webinars are focused on key topics in the industry and bring together leading experts to discuss trends and challenges in electronics manufacturing. Webinars to date have included:

  • Thermal Fatigue Reliability of High-Performance Pb-free Solder Alloys 
  • Quantifying Environmental Life Cycle Impacts for ICT Products: A Simpler Approach 
  • Low-Temperature Solder: Enabling the Future 
  • Proposed Testing Protocols to Align Connector Reliability with Application Requirements 

Presentations from these webinars are available on the iNEMI website.

Additional webinars are planned for July and August. Watch the iNEMI calendar for additional topics and dates.