Advancing Manufacturing Technology

August 2020 Newsletter
Saturday, August 1, 2020
Section: Monthly Newsletters




Events and Publications

August 2020

iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19

iNEMI recently published “Recommended Best Practices for Protecting the Reliability and Integrity of Electronic Products and Assemblies when Disinfecting for SARS-CoV-2 (COVID-19).” This document, developed by a team of experts from across iNEMI member organizations, provides guidance on how to mitigate the possible detrimental impact of disinfecting procedures on electronic equipment and assemblies. Many commonly recommended disinfection substances and/or application methods could potentially cause failures in electronic equipment. The iNEMI team reviewed key industry, government and technical sources. They also assessed the chemicals included in the U.S. EPA List N: Disinfectants for Use Against SARS-CoV-2 (COVID-19) and common application methods, identifying those substances that minimize the risk of negative impact on electronic equipment when applied in an appropriate manner. 

Project Activities

Call for Participation

Technology Integration Groups (TIGs)

Technology Integration Group (TIG) Meetings (members only) — The iNEMI TIGs play an important role in identifying key projects for collaboration. TIG participartion is open to all iNEMI member organizations and is an excellent way to help ensure that new projects focus on areas that are relevant to our members' needs. Following is a list of upcoming meetings. If you are interested in getting involved, contact the iNEMI project manager listed. 

Packaging TIG Webinar: Power Devices Qualification Requirements and Technical Challenges (August 26, open to all iNEMI members) — Eric Swenson (IBM) will share information about new qualification requirements for power packaging, especially with regards to emerging applications and new use conditions, including harsh environments.  

Roadmap Activities

iNEMI Roadmap Highlights Series — get the latest presentations from our review of highlights from iNEMI Roadmap chapters. The most recent chapters covered are:

  • Modeling, Simulation & Design Tools/Thermal Management — presented by Lesley Polka (Intel) and Azmat Malik (Accuventures)
     
  • Connectors — presented by John MacWilliams (USCompetitors LLC)

Coming in August:

IoT Suffers from a Lack of Standards: What the electronics industry must do to change that,” Joanne Friedman (Connektedminds) and Barbara Goldstein (NIST), Printed Circuit Design & Fab/Circuits Assembly, July 2020, pp 30-31.

The Future Of Manufacturing Is (Almost) Here,” Dan Gamota (Jabil), Forbes online, July 16, 2020. This article highlights information from iNEMI’s Smart Manufacturing roadmap. 

iNEMI / SMTA Technical Webinar Series

iNEMI/SMTA Technical Webinar Series — iNEMI continues its series of technical webinars with the Surface Mount Technology Association (SMTA). These webinars are focused on key topics in the industry and bring together leading experts to discuss key trends and challenges in electronics manufacturing. Presentations from the series are available, including the July webinar, “Impact of Low Temperature Soldering (LTS) on Electronic Package Dynamic Warpage Behavior & Surface Mount (SMT) Yields.”

 

Coming in August: