iNEMI has several new projects launching. These projects address technical gaps in a broad range of areas, including 5G, smart manufacturing, sustainable electronics, packaging and optical interconnect. If you’re interested in joining any of these projects, please contact the project managers listed below.
5G/mmWave Materials Assessment and Characterization — This project is addressing a critical industry gap by developing guidelines/best practices for a measurement and test methodology that can be used to support next-generation 5G/mmWave communications solutions. The project team will benchmark current available test methods, identify any gaps for extending test methods to 5G/mmWave frequencies, and develop reliable reference standard materials for set-up and calibration. Contact: Urmi Ray (firstname.lastname@example.org).
Smart Manufacturing: Data Management Best Practices for PCB Assembly — For PCB assembly manufacturers, achieving machine-to-machine (M2M) communications and closed-loop feedback using existing equipment is a key enabler to improve assembly line efficiency and yield. This project will develop a generic reference data architecture and best practices for a typical electronics assembly line to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. Contact: Kevin McGowan (email@example.com)
Non-Physical Data Destruction — This fast turn project will focus on data center expectations for data sensitization at end of life (EOL). It will demonstrate the feasibility of effectively and securely destroying data from EOL storage drives without physically destroying the drive itself, making it possible to leverage new business opportunities to decrease EOL expenses and increase the value that can be recovered from storage media. Contact: Mark Schaffer (firstname.lastname@example.org).
Package Warpage Prediction and Characterization — Dynamic warpage characterization of electronic packages is critical for high-yield board assembly. This project will enable improvements in package warpage prediction tools and techniques, with a focus on two areas: (1) warpage characterization of the latest advanced packaging technologies to quantify typical warpage ranges and trends that the industry can expect when implementing these technologies, and (2) material properties characterization of mold compounds and substrate raw materials to help understand the impact of curing process on eventual package warpage. A call-for-participation webinar is scheduled on July 2/3. Contact: Haley Fu (email@example.com)
High Density Interconnect Socket Warpage Prediction and Characterization — This project will investigate the warpage of high density, large size array sockets and the impact of socket design and fabrication process on warpage. The project aims to: (1) develop socket warpage measurement guidelines and prediction methods, (2) determine the impact of molding and design on large size socket warpage and (3) explore warpage mitigation approaches in SMT assembly process. A call-for-participation webinar is scheduled on July 2/3. Contact: Haley Fu (firstname.lastname@example.org)
Best Practices for Expanded Beam Connectors in Data Centers — The increased use of fiber optic connectors in data centers is driven by performance needs. Their use impacts operating expense due to the cleaning and inspection required. Expanded beam connectors, while still requiring inspection and cleaning, have less sensitivity to contamination and scratches than other optical connectors, leading to reduced cleaning needs. To date, there is no industry standard defining cleaning methods for expanded beam connectors, and no guidelines for a cleaning process. This project will address these gaps by developing industry cleanliness guidelines for use in data centers, enabling wider adoption of the technology, and will examine potential operational expense reduction. A call-for-participation webinar is scheduled July 7. Contact: Steve Payne (email@example.com)