Proposed Projects in Eco-Design and Extended Reliability Help Promote a Circular Economy in Electronics Manufacturing
iNEMI hosted a virtual workshop —Promoting a Circular Economy through Best Practices in Eco-Design and a Standardized Procedure for Extended Reliability Assessment— as part of this year’s Electronics Goes Green (EGG) conference. The workshop, moderated by Tom Okrasinski (Nokia Bell Labs), focused on two key areas identified by iNEMI members as opportunities for supporting the realization of a circular electronics economy. Julio Vargas (IBM) presented information about the industry-wide need for understanding and sharing of best practices in innovative eco-design, and Juan Dominguez (Intel Corporation) led a discussion about the benefits of quantifying the extended reliability potential of electronic systems. Break-out sessions for each topic captured the perspectives of the different stakeholders and identified relevant ongoing activities in these areas globally. Afollow-up working session is scheduled for September 30. This webinar (open to members and non-members) is an opportunity to learn about the two project proposals and provide live, interactive feedback and discussion with industry leaders.Read more.
Combined Efforts of iNEMI Projects Help Industry Quantify the Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior
Adoption of low temperature solder (LTS) has increased over the years. The fundamentals of dynamic warpage are well established in the SMT industry, but there is minimal literature on the application of low temperature solders, specifically for SAC BGAs with low temperature solder paste. iNEMI’sWarpage Characteristics of Organic Packagesproject has conducted a wide range of dynamic warpage characterization for different electronic package types — package-on-package, fine pitch BGA, large FCBGA packages with and without lids, and PBGA packages. The resulting warpage database, generated over more than 10 years, combined with results from iNEMI’sBiSn-Based Low-Temperature Soldering Process and Reliabilityproject, can help industry understand and quantify the impact of low temperature solder on dynamic package warpage behavior.Read more.
Welcome to our newest members.
Happy milestone anniversaries to the following iNEMI members.
5 years: Insidix & Shinko Electric
10 years: Akrometrix
Value Recovery Project Featured in MRS Energy & Sustainability
The August 12 issue of MRS Energy & Sustainability includes an in-depth case study of work completed by iNEMI’s Value Recovery from Hard Disk Drives project. The article — “The use of decision support tools to accelerate the development of circular economic business models for hard disk drives and rare-earth magnets” — describes how the project team leveraged decision support tools (DSTs) to assess the complex interaction of variables that must be considered when demonstrating the viability of circular business models (CBMs).
It describes how a mix of quantitative and qualitative DSTs such as life cycle assessment, techno-economic assessment, Ostrom's Framework for social-ecological systems, decision trees, and others were implemented by the iNEMI Value Recovery project team to overcome many of the identified/known barriers to circular economy. In addition, demonstration projects were used as a low-risk opportunity for business model experimentation and to build trust among key supply chain actors.
Congratulations to authors Kali Frost (Purdue University), Hongyue Jin (University of Arizona), William Olson (ASM International), Mark Schaffer (iNEMI), Gary Spencer (Geodis Reverse Logistics) and Carol Handwerker (Purdue) for an excellent article. Read more.
iNEMI and IPC Sign Updated MOU
iNEMI recently signed a Memorandum of Understanding (MoU) withIPCto collaborate and share information on developing technology roadmaps, organizing forums, establishing new programs, and identifying additional industry needs and projects for the mutual benefit of the membership of both organizations. iNEMI has a long-standing relationship with IPC, dating back 20+ years, and this updated MoU reinforces the iNEMI/IPC partnership and the benefits of collaboration across the electronics manufacturing eco-system.Read more.
New Lead-Free Book References iNEMI Projects
iNEMI work is referenced in a new book, Lead-free Soldering Process Development and Reliability, published by John Wiley & Sons this July. The book provides a comprehensive discussion of modern topics in lead-free soldering, and iNEMI work is included in the chapters on Low Temperature Lead-Free Alloys and Solder Pastes (by Raiyo Aspandiar, Nilesh Badwe and Kevin Byrd, all of Intel) and Lead (Pb)-Free Solders for High Reliability and High-Performance Applications (by Richard J. Coyle, Nokia Bell Labs). For additional details.