|Demand for more effective and cost-efficient means of removing heat from electronic systems continues to grow across all segments of the industry from compact, portable electronics to large, high-end systems, as well as power electronics associated with transportation and the electrical grid. In the absence of major new breakthroughs in thermal management technology this demand is being met by broader, more aggressive use of existing techniques and increased emphasis on reducing the generation of heat through improved product design.
This chapter addresses the need to develop improved cooling technology in terms of heat transfer processes, materials, and innovative designs. If successfully implemented, enhanced thermal management will contribute to continued performance improvement trends and increased competitiveness of packaged electronic products.
The chapter is extensive in content, containing 161 pages including six tables and 79 figures. While developed by a small group of experts, they represent some of the most well-known professionals in the field.