|For purposes of this roadmap, the board assembly processes include leaded component insertion (for wave soldering) and/or solder paste application (for SMT) on the bare PCB and ends at printed circuit board assembly (PCBA) test. It also includes special processes such as underfill application, odd form component placement, etc. Although test and inspection occur throughout the board assembly process, they are addressed in another roadmap chapter (Test, Inspection, and Measurement Chapter).
The Board Assembly chapter focuses on the different areas within the board assembly process, including: new product Introduction, assembly materials, surface mount technology (SMT), placement, dispense technology, wave and selective soldering, press fit, rework, ESD issues and direct chip attach (DCA). It looks at business trends as well as technology trends and identifies and prioritizes technology gaps. The critical technology attributes are quantified over the 10-year roadmap horizon in 28 tables and 18 figures. Thirty-six individuals from a variety of EMS, OEM, and supplier companies contributed on this chapter – truly an industry effort!