Advancing Manufacturing Technology

High-Speed Signaling Connector Metrology


We are still seeking additional project membership.

Statement of Work and Project Statement (PDF file)


With regards to connector high-speed signaling performance characterization, a lot of work has already been done by major connector manufacturers on things like sockets, backplane connectors and high speed IO connectors. This is done through various modeling and simulation tools. Some manufacturers, such as Molex, TE, FCI, Samtec and others, publish Spice models for use by customers online.
The current state-of-the-art in high-speed connectors includes: 10-25Gbps backplane, 10-40GbE, 10Gbps Thunderbolt, 4.8 going to 9.6Gbps USB and of course fiber optic solutions.
Higher interconnect signaling speeds and bandwidth requirements are driving the need for characterizing signal integrity of sockets and connectors and the need for consistent measurement methodologies.
This project group plans to characterize and measure socket and connector electrical parameters as to:
  • Define metrology requirements for time and frequency domain
  • Cross-company matching of socket and connector electrical parameters using predefined test boards and sample units
  • Drive common database / data formats of test results for customers to use


Call-for-Participation Presentation:  High-Speed Signaling Metrology and Standard Reliability Qualification Projects (March 14, 2014)

Steps for Joining the Project

Please note: iNEMI membership is required to participate in this project. The period for becoming a founding member for this project has closed, but we are still actively seeking additional project membershp.  Please contact David Godlewski for more information.
For iNEMI members:
  • Complete and sign the project statement
  • Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to
For non-members:

Further Information

David Godleski