Statement of Work and Project Statement
The project will evaluate the impact of the use of mold compounds, with a lower Coefficient of Thermal Expansion (CTE) on the reliability of second level solder joints for common package types. A combination of a review of existing data, Finite Element modelling (FEM) and experimental testing will be employed to determine if, in which cases and to what extent the use of low CTE mold compounds has a negative impact on second level interconnect reliability. Recommendations to ensure acceptable reliability performance for certain package types under certain operation conditions will be developed.
This will be a 2 phase project. Phase 1 will focus on collecting data from the project team and industry regarding reliability issues associated with the transition to lower CTE mold materials. The detailed experiment design and FEM approach for Phase 2 will be optimized based on the input and results from Phase 1. A new SOW for Phase 2 of this project will be submitted for review again to the iNEMI Technical Committee prior to commencement of Phase 2.