iNEMI Member Meeting (Japan 2016)
Presentations from iNEMI Member Meeting
Hosted by Hitachi Chemical HQ
Tokyo, Japan
February 19, 2016
Hitachi Chemical hosted this members’ meeting in Japan at their HQ office in Tokyo. Thirteen people attended the meeting. Five presentations were made by iNEMI members:
- Novel Conformal Organic Coating on Copper Surface, presented by Simon Lee (Dow Electronic Materials)
- Non-Contact Open Test Technology VTEP, presented by Koichi Wada (Keysight Technology)
- iNEMI Warm Assembly Initiatives, Kinya Ichikawa (Intel K.K.)
- Pros and Cons of Encapsulation Material for Warm Assembly, presented by Takahiro Horie (Hitachi Chemical Co., Ltd.)
- Laminate Material for Warm Assembly, presented by K. Oohashi (Hitachi Chemical Co., Ltd.)
- Possibility of Low Temp Pb-Free Solder, presented by Yoshikawa (Senju)
- iNEMI Project Updates
- 2017 iNEMI Roadmap Update and Schedule
- Automotive Survey Results
- Package/Substrate Technology Workshop in Singapore