Event Calendar

Wednesday, September 20, 2017

Webinar: Introducing Polymer Outgassing Metrology Survey Results

Start Date: 9/20/2017 9:00 AM EDT
End Date: 9/20/2017 10:00 AM EDT

Location:
United States 

Wednesday, September 20, 2017
9:00 a.m. EDT (US)
3:00 p.m. CEST (Central Europe)
9:00 p.m. CST (China)
10:00 p.m. JST (Japan)

This webinar will provide the survey results of polymer outgassing metrology and discuss this project planning.  If you are interested in this metrology, please register for the webinar.  The webinar is free for anyone, but pre-registration is required for organizational purposes. Once you register, you will receive a confirmation email with instructions for joining the meeting.

Register here.

Background
Outgassing, or the release of gas from a solid material, can be a major concern with plastics and elastomers. The outgassed material can condense on nearby sensitive equipment, potentially affecting the performance and precision of these components.  High heat and high moisture increase the potential for outgassing.

The materials used in current packaging technology — from the core material to solder resist, epoxy and molds — use hygroscopic materials. These materials absorb moisture from the surrounding environment, diffuse the moisture deeply into the package, and then desorb it when subjected to elevated or reflow temperatures. In a typical component board assembly, the reflow process ramps from room temperature to a peak reflow temperature of ~260°C in a very short time, and the trapped moisture may have difficulty escaping due to blockage by hydrophobic materials such as copper, silicon and solder as well as the design features of the substrate.

In addition to moisture, volatile compounds from polymeric materials can be a cause for concern and may indicate the level of by-products being released and the reliability or stability of the chemical.

Outgassing and product durability have been the focus of research not only in electronic packaging but also in the aerospace, food technology, and medical industries. However, there is a lack of understanding about how to leverage the material properties quantified by existing metrology and modeling capabilities to address the moisture and volatile compounds that may impact package reliability. iNEMI plans to address this issue.

Further Information
Masahiro Tsuriya
m.tsuriya@inemi.org