Start Date: 8/28/2017 9:00 AM EDT
End Date: 8/29/2017 5:30 PM EDT
Location:
United States
Session 1 - Asia / North America
August 29, 2017
9:00 a.m. CST (China)
August 28, 2017
6:00 p.m. PDT (North America)
9:00 p.m. EDT (North America)
Session 2 - North America / Europe
August 29, 2017
10:00 a.m. EDT (North America)
3:00 p.m. BST (Europe)
4:00 p.m. CEST (Central Europe)
iNEMI members, please join us to learn the key progress and achievements of iNEMI programs.
Registration
This webinar is for iNEMI members only. Registration is required.
Click here for registration. Be sure to register for the session you want to attend. You must be logged into your iNEMI member web account to access the registration page. If you don't know whether you have an account, go here and enter your email to retrieve your username and password. If you do not have a web account, please create one now.
Preliminary Agendas
Session 1 (Asia)
Introduction - Bill Bader, iNEMI
iNEMI Status and Calendar - Bill Bader, iNEMI
Deployment Status - David Godlewski, iNEMI
Technical Plan Status - Chuck Richardson, iNEMI
Packaging & Component Substrates TIG Status - Kyu-oh Lee (Intel), Co-Chair
eWLB FOWLP: Good to Great, Dr. Seung Wook Yoon (STATS ChipPAC)
Session 2 (North America/Europe)
Introduction - Grace O'Malley, iNEMI
iNEMI Status and Calendar - Grace O'Malley, iNEMI
Deployment Status - David Godlewski, iNEMI
Technical Plan Status - Chuck Richardson, iNEMI
Packaging & Component Substrates TIG Status - Chuck Woychik (i3 Electronics), Chair
eWLB FOWLP: Good to Great, Dr. Seung Wook Yoon (STATS ChipPAC)