Advancing Manufacturing Technology

Event Calendar

Thursday, June 14, 2018

End-of-Project Webinar: iNEMI-IPSR Board-Level Optical Interconnect Project - Session 2 (APAC)

Start Date: 6/14/2018 10:00 AM JST
End Date: 6/14/2018 11:00 AM JST

Location:
Japan 

Two sessions are being scheduled to accommodate different time zones.  These webinars are open to industry.
 

  • Session 2 - Asia / North America
    Thursday, June 14, 2018
         9:00 a.m. CST (China)
         10:00 a.m. JST (Japan)
    Wednesday, June13, 2018
         6:00 p.m. PDT (North America)
         9:00 p.m. EDT (North America)
    Register here for Session 2
     
  • Session 1 - North America / Europe
    Wednesday, June 13, 2018
         8:00 a.m. PDT (North America)
         11:00 a.m. EDT (North America)
         4:00 p.m. BST (London)
         5:00 p.m. CEST (Central Europe)
    Register here for Session 1
The iNEMI-IPSR Board-Level Optical Interconnect Project is well-aligned with the American Institute for Manufacturing Integrated Photonics (AIM Photonics), iNEMI, the MIT MicroPhotonics Center, the Integrated Photonic Systems Roadmap (IPSR) and other optoelectronics roadmaps.  Industry roadmaps predict that silicon-photonics-based transceiver modules will provide the most cost-effective solutions for on-board interconnections in the future.  However, before the anticipated cost benefits of silicon photonics can be realized, new high-performance and cost-effective solutions to optical packaging and connectorization must be developed.
 
Phase 1 of this iNEMI-IPSR project was organized to assess the performance of prototypes of board-level interconnect systems based on single-mode (SM) fiber, expanded-beam optical coupling, and silicon photonics transceivers. The objective was to evaluate existing and developing components and identify gaps in the board-level technologies needed for practical implementation.
 
This end-of-project webinar will review results of the project team’s efforts to design, assemble and test a prototype on-board fiber optic interconnection system based on silicon photonic transceiver modules, single-mode fiber cables, and expanded-beam optical connectors for the package, backplane, and front-plane interfaces. 

More information about this project.