Advancing Manufacturing Technology

Thursday, March 15, 2018

Call for Project Signup Webinar: Wafer/Panel Level Package Flowability and Warpage - Asia Pacific

Start Date: 3/15/2018 8:00 AM CST
End Date: 3/15/2018 9:00 AM CST


This webinar is open to industry.

Session 2 - For participants from North America and Asia Pacific
Wednesday, March, 14, 2018
     6:00-7:00 p.m. PDT (North America)
Thursday, March 15, 2018
     9:00-10:00 a.m. CST (China)
Click here to register for this session.

Session 1 is being held on March 8, 2018.

More information about this project.