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Thursday, October 26, 2017


Call for Participation: Wafer/Panel Level Package Flowability and Warpage (Asia)

Event Details

Start Date:  10/26/2017 8:00 AM CST
End Date:  10/26/2017 9:00 AM CST
Location:  China

Thursday, October 26, 2017
     8:00 a.m. CST (China)
Wednesday, October 25, 2017
     8:00 p.m. EDT (USA)

This call for participation webinar is to help define a new initiative to investigate Wafer/Panel Level Package Flowability and Warpage.  This new initiative aims to identify key processing parameters and factors that influence flowability and investigate the factors from flowability that impacts warpage. If this is a topic of your interest, please join and help us define appropriate project scope, develop the project SOW (statement of work), and establish the team/resources to enable the project.

Register here.  This webinar is open to industry.  In advance registration is required. You should receive an email with meeting access information after you register.

More information about this project.

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