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Wednesday, October 25, 2017


Call for Participation: Wafer/Panel Level Package Flowability and Warpage (USA)

Event Details

Start Date:  10/25/2017 8:00 PM EST
End Date:  10/25/2017 9:00 PM EST
Location:  United States

Wednesday, October 25, 2017
     8:00 p.m. EDT (USA)
Thursday, October 26, 2017
     8:00 a.m. CST (China)

This call for participation webinar is to help define a new initiative to investigate Wafer/Panel Level Package Flowability and Warpage.  This new initiative aims to identify key processing parameters and factors that influence flowability and investigate the factors from flowability that impacts warpage. If this is a topic of your interest, please join and help us define appropriate project scope, develop the project SOW (statement of work), and establish the team/resources to enable the project.

Register here.  This webinar is open to industry.  Advance registration is required. You will receive an email with meeting access information after you register.

More information about this project.

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