Advancing Manufacturing Technology

Thursday, October 19, 2017

Research Webinar: Knowledge-Based Qualification - Meeting Challenges of New Markets and New Technologies

Start Date: 10/19/2017 9:00 AM CST
End Date: 10/19/2017 10:00 AM CST

Location:
China 

Thursday, October 19, 2017
     9:00 a.m. CST (China)
Wednesday, October 18, 2017
     6:00 p.m. PDT (USA)

This webinar is open to industry.  Registration is required in advance.  Once you register, you will receive an email with instructions for joining the webinar.

Register here for this webinar.

The electronics component market is rapidly evolving and manufacturers are under tremendous pressure to build better and cheaper products with short time to market. At the same time they need to ensure that these products perform reliably in the field. New technologies are increasingly more complex than technologies of the past, while use conditions are constantly evolving.  This requires quality and reliability engineers to look beyond the existing reliability standards so that they make sure their components are designed right for the field.

This talk discusses challenges with traditional approaches for definition of qualification requirements for package certifications and proposes a methodology for overcoming those challenges. The proposed methodology leverages the knowledge of use conditions and fundamental physics, and couples it with advanced computational mechanics modeling. The special focus is on the essential role of the physics based damage metrics in scaling from use condition to test conditions and in design for reliability. This Knowledge-based Qualification methodology is discussed relative to Standards-based Qualifications showing that Knowledge-based Qualification provides a superior technical framework for enabling future packaging technologies and customer designs. Multiple examples will be provided to illustrate the impact of the proposed Knowledge-based Qualification on design, cost, and system level optimization.

This webinar is for technologists and managers who work in the areas of design and reliability of electronic components and packages.

Speaker Bio
Dr. Milena Vujosevic is a Principal Engineer and Sr. Manager at Intel.  She has 20 years of experience in the semiconductor  industry, working in the areas of technology development, design and reliability for MEMS, electronic packaging and systems.  At Intel, she drives strategic developments in reliability methodologies to enable future generations of packaging technologies across market segments (automotive, data centers, mobile, wearables, etc). Prior to joining Intel in 2005, she worked for Motorola. Milena has published more than 60 papers, three book chapters and delivered multiple invited presentations.  She is a recipient of the 2011 ASME Women Engineer of the Year award for significant achievements in the field of electronic and photonic packaging. Milena has a PhD in mechanical engineering.