2015 iNEMI Technical Plan


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2015 iNEMI Technical Plan
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2015 iNEMI Research Priorities



Background

Development of the iNEMI Technical Plan, along with the Research Priorities, is a continuation of the roadmapping process. The roadmap identifies technology gaps and needs.  Follow-up "gap analysis" meetings help prioritize those needs and identify the ones that can most effectively be addressed through industry collaboration.

The purpose of the iNEMI Technical Plan is to provide a concise, yet complete, presentation of the gaps between present industry capabilities as represented by state-of-the-art-practices, and future industry needs as forecast by the iNEMI Roadmap. A members-only document, the Technical Plan lays out a five-year plan that defines the projects and activities deemed necessary to close the identified gaps. These plans become the basis for iNEMI projects.

Efforts to close the identified technology gaps are undertaken by iNEMI’s Technology Integration Groups (TIGs) in the areas of board assembly, environmentally sustainable electronics, medical electronics, MEMS, optoelectronics, organic packaging substrates, organic PCB and test.

After the biannual roadmapping activities are completed and technical direction is established, each TIG conducts a gap analysis, based on the needs identified in the roadmap, to define and prioritize the gaps to be addressed. Research priorities are defined, potential projects are identified to close new gaps, a technical plan is devised, and specific projects are implemented.

The Technical Plan is a culmination report of the implementation cycle activities, and focuses on the TIGs’ priorities, plans, and prospects. Each TIG section in the Technical Plan is organized into five parts: an introduction, a gap analysis graphic, an implementation plan graphic, a review of changes that have developed since the last technical plan, and a summary.