Metrology for New Package Technology Qualification Initiative

Project Leader:
Feng Xue, IBM

Project Leader:
Curtis Grosskopf, IBM


Call for Participation Webinar

A webinar will be scheduled in June 2017.  Please check back to register for this webinar.

Statement of Work and Project Statement

  • These documents are currently being drafted.

Purpose of Initiative

The purpose if this initiative is to develop a methodology for qualifying new packaging technology to address gaps.

Further Information

Masahiro Tsuriya