The 2017 Roadmap is now on sale. Get pricing information.
The 2017 Roadmap is a global collaborative effort that involves many individuals who are leading experts in their respective fields and represent many perspectives on the electronics manufacturing supply chain. More than 500 individuals from at least 22 countries, and representing more than 350 corporations, consortia, government agencies and universities came together to create the 2017 Roadmap.
This latest edition is our largest to date. With 2300+ pages, the 2017 Roadmap contains seven Product Emulator Group (PEG) chapters that anticipate the product needs of the future. They define the technology needs of key market segments by focusing on the market demands and functionality requirements of seven industry segments. New this year is the Internet of Things (IoT) chapters.
In addition to the product segments, there are 21 Technology Working Group (TWG) chapters that identify key technology developments anticipated and required within the electronics manufacturing supply chain to meet product needs between now and 2027.
|Ceramic Substrates & PV Technology||Packaging & Component Substrates|
|Energy Storage||Power Conversion Electronics|
|Final Assembly||RF Components & Subsystems|
|Flexible Hybrid Electronics||Semiconductor Technology|
|Information Management||Solid State Illumination|
|Interconnect PCB-Organic||Sustainable Electronics|
|Mass Data Storage||Test, Inspection & Measurement|
|MEMS / Sensors||Thermal Management|
|Modeling, Simulation & Design Tools|