2017 Roadmap

NOW ON SALE

The 2017 Roadmap is now on sale.  Get pricing information.
 

About this Roadmap

The 2017 Roadmap is a global collaborative effort that involves many individuals who are leading experts in their respective fields and represent many perspectives on the electronics manufacturing supply chain.  More than 500 individuals from at least 22 countries, and representing more than 350 corporations, consortia, government agencies and universities came together to create the 2017 Roadmap. 

This latest edition is our largest to date. With 2300+ pages, the 2017 Roadmap contains seven Product Emulator Group (PEG) chapters that anticipate the product needs of the future. They define the technology needs of key market segments by focusing on the market demands and functionality requirements of seven industry segments. New this year is the Internet of Things (IoT) chapters. 

In addition to the product segments, there are 21 Technology Working Group (TWG) chapters that identify key technology developments anticipated and required within the electronics manufacturing supply chain to meet product needs between now and 2027. 

Presentations

  • 2017 iNEMI Roadmap, presented by Alan Rae (iNEMI Consultant) at ICSR Conference (June 7, 2017; Markham, Ontario)
     
  • Click here for a list of other roadmap presentations

Product Emulator Group (PEG) Chapters

The 2017 iNEMI Roadmap will contain seven chapters that anticipate the product needs of the future. They define the future technology needs of “virtual generic products” from key market segments by focusing on the market demands and functionality requirements of these industry segments.
  • Aerospace & Defense
  • Automotive
  • Consumer / Office Systems
  • High-End Systems (servers, computing, netcom - network/datacom/telecom/cloud)
  • Internet of Things (IoT) (new PEG)
  • Medical
  • Portable / Wireless
 

Technology Working Group (TWG) Chapters

The remaining 21 chapters of the 2017 Roadmap will identify technology and infrastructure trends. They focus on the key technology capabilities and developments anticipated and required within the electronics manufacturing supply chain to meet anticipated product needs between now and 2027.

 
Board Assembly Optoelectronics
Ceramic Substrates & PV Technology Packaging & Component Substrates
Connectors Passive Components
Energy Storage Power Conversion Electronics
Final Assembly RF Components & Subsystems
Flexible Hybrid Electronics Semiconductor Technology
Information Management Solid State Illumination
Interconnect PCB-Organic Sustainable Electronics
Mass Data Storage Test, Inspection & Measurement
MEMS / Sensors Thermal Management
Modeling, Simulation & Design Tools