Advancing Manufacturing Technology

Member Newsletter

November 2017

Download November Member Newsletter

New iNEMI Member
     Urban Mining Company
Register today for the Q4 iNEMI Member Update
iNEMI at events in Germany this month

iNEMI Projects
     New Projects in Sign-Up
          Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology
          Wafer/Level Package Flowability and Warpage
     Upcoming Project Reports Scheduled:
          Reuse and Recycling Metrics
          Qualification Test Development for Creep Corrosion, Phase 3
Upcoming Events  
     iNEMI roadmap presentation at SMTA chapter meeting - November 11
     IEEE SusTech 2017 (Phoenix, Arizona, USA) – November 12-14
     Webinar: Q4 iNEMI Member Update – November 20 & 21
     EcoDesign 2017 (Tainan, Taiwan) – November 29 – December 1
     Mid-Project Webinar: Reuse and Recycling, Phase 2 – December 5
     End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3 – December 12/13
Featured News and Content
     Webinar: Knowledge Based Qualification - Meeting Challenges of New Markets and New Technologies
     Call for participation presentation: Wafer/Panel Level Package Flowability and Warpage
     iNEMI Session at 2017 IMPACT
     Call for participation presentation:  Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
     End-of-project webinar presentation and final report:  Final Assembly Automation and Optimization
Roadmap
     iNEMI Technical Plan is Available
     Research Priorities Development Proceeding
     PEG Work Started on 2019 Roadmap
 

October 2017

Download October Member Newsletter

iNEMI Technical Plan Published
Research Webinar:  Knowledge-Based Qualification - Meeting Challenges of New Market and News Technologies - October 19
iNEMI Session at IMPACT 2017 (Taipei) - October 27
Deadline for Dues Discount is October 31

iNEMI Projects
     Wafer/Level Package Flowability and Warpage
     Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
     Value Recovery from Used Electronics, Phase 2
     Eco-Design Best Practices
     Upcoming Project Webinars Scheduled:
          Final Assembly Automation and Optimization
          Reuse and Recycling Metrics
          Qualification Test Development for Creep Corrosion, Phase 3
Upcoming Events  
     Webinar: Knowledge-Based Qualification - Meeting Challenges of New Markets and New Technologies – October 18/19
     Call for Participation: Wafer/Panel Level Package Flowability and Warpage – October 25/26
     iNEMI Session at 2017 IMPACT (Taipei, Taiwan) – October 27
     Call for Participation: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2 – October 31 & November 1
     End-of-Project Webinar: Final Assembly Automation & Optimization – November 2
     FUTURECAR 2017 (Atlanta, Georgia, USA) – November 8-10
     IEEE SusTech 2017 (Phoenix, Arizona, USA) – November 12-14
     Webinar: Q4 iNEMI Member Update – November 20 & 21
     EcoDesign 2017 (Tainan, Taiwan) – November 29 – December 1
     Mid-Project Webinar: Reuse and Recycling, Phase 2 – December 5
     End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3 – December 12/13
Featured News and Content
     Presentation: Roadmap Webinar: Board Assembly Chapter
     Presentation: Eco-Design Best Practices Project Call for Participation Webinar
     Presentation: SMTAI Luncheon Keynote – 2017 iNEMI Roadmap Highlights Impacting Board Assembly Over the Next 5-10 Years, Bill Bader (iNEMI)
     iNEMI presentations at SMTA International (Rosemont/Chicago, Illinois, USA)
     Presentation: Highlights of iNEMI 2017 Roadmap; presented by Steve Payne (iNEMI), ICT-Institute of Circuit Technology (Hayling Island, United Kingdom)
     Presentation: Results from Polymer Outgassing Metrology Survey (iNEMI webinar)
     Press interviews at SMTA International
Roadmap
     Research Priorities Development Proceeding
     2019 Roadmap Cycle Launched
 

September 2017

Download September Member Newsletter

iNEMI Welcomes Linda Wilson as New Roadmap Manager
iNEMI Webinar:  Board Assembly Roadmap
Polymer Outgassing Metrology Survey Results - September 20
Take Advantage of Discount on Membership Dues
Fall Conferences

     SMTAI
     IMPACT 2017
iNEMI Projects
     Value Recovery from Used Electronics, Phase 2
     Eco-Design Best Practices
Upcoming Events  
     iNEMI Roadmap Webinar - Board Assembly - September 13
     Call for Participation Webinar:  Eco-Design Best Practices Project - September 13 & 14
     iNEMI at SMTAI - September 17-21
     Electronics Packaging Symposium - September 19-20
     Webinar: Results from Polymer Outgassing Metrology Survey - September 20
     Fall 2017 IPSR Meeting
     iNEMI Session at 2017 IMPACT
     FUTURECAR 2017 - November 8-10
     IEEE SusTech 2017 - November 12-14
     Webinar: Q4 iNEMI Member Update - November 20 & 21
Featured News and Content
     Press Release:  iNEMI Names New Roadmap Manager
     Presentation: iNEMI Regional Member Meeting in Japan
     Presentation: Q3 iNEMI Member Update Webinar
     Presentation: Packaging & Component Substrates Roadmap Webinar
     Presentation: PCB/PCBA Material Characterization for Automotive Harsh Environments End-of Project Webinar
New from the iNEMI Blog
     Flexible Hybrid Electronics Key to a Personalized Digital Future, by Daniel Gamota (Jabil)
Roadmap
     iNEMI Technical Plan Nearing Completion
     Research Priorities Development Proceeding

 

August 2017

Download August Member Newsletter

Discount Offered on Membership Dues
Quarterly Member Update - August 29
Automotive Project Publishes Report, Schedules Webinar
Fall Conferences

     SMTAI
     IMPACT 2017
iNEMI Projects
     Value Recovery from Used Electronics, Phase 2
     New Packaging Technology Qualification Methodology
     Warpage Characteristics of Organic Packages, Phase 4
Upcoming Events  
     IPSR Webinar Series:
          Integrated Photonic Sensors Manufacturing - August 10
          Assembly Processes - August 24
     Q3 iNEMI Member Update Webinar, August 28 & 29
     iNEMI Roadmap Webinar: Packaging & Component Substrates - August 30
     Call for Participation: Value Recovery from Used Electronics, Phase 2
     End-of-Project Webinar: PCB/PCBA Material Characterization for Automotive Harsh Environments - September 7
     iNEMI Roadmap Webinar- September 13
     iNEMI at SMTAI - September 17-21
     iNEMI Session at 2017 IMPACT
     FUTURECAR - November 8-10
New from the iNEMI Blog
     Packaging Innovation Maintains the Pace of Progress as Moore's Law Scaling Slows, W.R. (Bill) Bottoms
Roadmap
     Chapter-Focused Webinars Planned
          Packaging & Component Substrates - August 30
          Board Assembly - September 13
iNEMI Technical Plan Progresses
Research Priorities Development Meeting Held in July

 

July 2017

Download July Member Newsletter

iNEMI Member Meeting in Tokyo - August 4
Quarterly Member Update - August 29
William Chen Receives IEEE Award
We Need Your Input:  Survey to Assess Polymer Outgassing Metrology
iNEMI Projects

     New Packaging Technology Qualification Methodology
     PCB Warpage Characterization & Minimization Project
     Warpage Characteristics of Organic Packages, Phase 4
     End-of-Project Webinar: Electronic Materials for Automotive Harsh Environments
Featured News and Content
     Presentation:  A Vision for the Circular Economy in Hard Disk Drives Based on Self-Management of Common Pool Resources, presented by Colin Fitzpatrick, at ISIE-ISSST (June 29; Chicago) 
     Presentation: iNEMI Roadmap 2017, presented by Alan Rae at the International Conference on Soldering & Reliability (Toronto; June 7).
New from the iNEMI Blog
     Mass Data Storage Roadmap Points to Further Growth in NAND as well as HDD, Tape and Optical Technologies, by Roger F. Hoyt   
Upcoming Events  
     Call for Participation Webinar:  Warpage Characteristics or Organic Packages, July 27 & 28
     iNEMI Member Meeting in Tokyo - August 4
     Q3 iNEMI Member Update Webinar, August 28 & 29
     End-of-Project Webinar: Electronic Materials for Automotive Harsh Environments - September 7
     iNEMI at SMTAI - September 17-21
     iNEMI Session at 2017 IMPACT
Roadmap
     TIGs Continue Work on iNEMI Technical Plan

 

June 2017

Download June Member Newsletter

New iNEMI Member
     Critical Materials Institute (CMI)
Board of Directors Election Results
We Need Your Input:  Survey to Assess Polymer Outgassing Metrology
iNEMI Projects

     iNEMI-IPSR Board-Level Optical Interconnect Project
     PCB Warpage Characterization & Minimization Project
Featured News and Content
     Presentations:  Q2 iNEMI Members Webinar, May 8 & 9
     Presentations:  iNEMI Session at ICEP; Yamagata, Japan, April 20
     Presentation: Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards, June 2017
Upcoming Events  
     Call for Participation Webinar:  PCB Warpage Characterization and Minimization, June 14 & 15
     iNEMI Presentation at 2017 Joint Conference ISIE and ISSST, Chicago, Illinois, June 29
     Q4 iNEMI Member Update Webinar, August 28 & 29
Roadmap
     Five of Seven TIGs Up and Running as Work on Technical Plan Progresses

 

May 2017

Download May Member Newsletter

New iNEMI Member
     Silicon Valley X-Ray Inc. (SVXR)
Q2 Member Update Webinar (May 9)
iNEMI Projects

     iNEMI-IPSR Board-Level Optical Interconnect Project
Featured News and Content
     Presentations:  2017 Roadmap Highlights Webinars (April 6 & 7)
     Presentations:  iNEMI & CDCC Workshop: Corrosion in Data and Telecom Centers (April 24; Shanghai, China)
     Presentation: Highlights of the Passives Chapter from the 2017 iNEMI Roadmap, Chuck Richardson (iNEMI), Electronic Components Industry Association (ECIA) Spring Engineering Summit (May 3; Herndon, Virginia)
Upcoming Events  
     Q2 iNEMI Member Update Webinar, May 8/9
     R2i-2017 Innovation Workshop, Dublin, Ireland, May 18
     iNEMI Presentation at 2017 Joint Conference ISIE and ISSST, Chicago, Illinois, June 29
     iNEMI Presentation at Toronto Expo & Tech Forum, co-located with International Conference on Soldering & Reliability, Markham, Ontario, June 7
Roadmap
     Additional Chapters and Full Roadmap Published
     TIGs Developing iNEMI Technology Plan

 

April 2017

Download April Member Newsletter

iNEMI Welcomes Three New Members
     METech Recycling
     Pegatron Corporation
     Shenmao Technology Inc.    
Value Recovery Report Published
iNEMI Projects

     iNEMI-IPSR Board-Level Optical Interconnect Project
     Approaches to Minimize PCB Warpage in Board Assembly Process to Improve SMT Yield
Upcoming Events  
     iNEMI Session at ICEP Conference, Yamagata, Japan, April 20
     iNEMI & CDCC Workshop, Shanghai, China, April 24
     Q2 iNEMI Member Update Webinar, May 8/9
     R2i-2017 Innovation Workshop, Dublin, Ireland, May 18
     iNEMI Presentation at 2017 Joint Conference ISIE and ISSST, Chicago, Illinois, June 25-29   
Sign Up Today:  Q2 Member Update (May 8/9)
Featured News and Content
     Keynote:  Packaging Trends and Challenges, 2017 IMAPS-UK Microtech, March 16
     Value Recovery Project Report, April 2017
     iNEMI Optoelectronics TIG and Project Meetings at OFC 2017, March 20
     End-of-Project Webinar: High-Temperature, Pb-Free Die Attach Material Project, Phase 1, March 23
     Latest Blog Post:  IoT is a Revolutionary Force in Many Areas
Roadmap
     Additional Roadmap Chapters Published - Available Online for Members

 

March 2017

Download March Member Newsletter

iNEMI Welcomes Tin Products Manufacturing Company
Nominations for iNEMI Board of Directors
Get Involved:  iNEMI TIGs and Technical Plan
Presentations from iNEMI Member Meeting in Japan
Integrated Photonics
    
Integrated Photonic Systems Roadmap Available
Upcoming Events 
     AIM Photonics Spring 2017 Meeting, Cambridge, Massachusetts, March 28-29
     iNEMI Session at ICEP Conference, Yamagata, Japan, April 20
     iNEMI & CDCC Workshop, Shanghai, China, April 24
Save the Date
     Make plans to join us for the 2017 iNEMI Roadmap Webinar, April 6-7
Meetings in Asia
     ICEP 2017 Conference, Yamagata, Japan, April 20
     iNEMI & CDCC Workshop, Shanghai, China, April 24
Featured News and Content
     End-of-Project Webinar Presentation:  Fine Pitch Circuit Pattern Inspection Metrology, February 21
     End-of-Project Webinar Presentation:  Ultra Low Loss Laminate-PCB, March 7/8
     APEX 2017 Presentations
iNEMI Projects
     New Project:  Approaches to Minimize PCB Warpage in Board Assembly Process to Improve SMT Yield
     End-of-Project Webinar:  High Temperature, Pb-free Die Attach Material Project, March 22/23


February 2017

Download February Member Newsletter

Roadmap Webinars Set
Get Involved:  iNEMI TIGs and Technical Plan
Integrated Photonics

     Integrated Photonic Systems Roadmap
     IPSR Consortial Projects
Upcoming Events 
     Keynote presentation, MicroTech 2017 (UK), March 16
     iNEMI Optoelectronics TIG and Project Meetings at OFC 2017, Los Angeles, California, March 20
     IPSR Meetings at OFC 2017, Los Angeles, California, March 19-21
     Webinar: Highlights of 2017 iNEMI Roadmap, April 6 & 7
     iNEMI Session at ICEP Conference, Yamagata, Japan, April 20
     AIM Photonics Spring 2017 Meeting, Cambridge Massachusetts, March 28-29
Save the Date for Quarterly Member Webinars
     Q2:  May 8 & 9
     Q3:  August 28 & 29
     Q4:  November 20 & 21    
Featured News and Content
     Presentations from iNEMI's First Quarter Member Webinar, February 6 & 7
     Latest blog post:  Building a Circular Economy in the Electronics Industry
iNEMI Projects
     Three End-of-Project Webinars Scheduled
          Fine Pitch Circuit Pattern Inspection & Metrology, February 20/21
          Ultra Low Loss Laminate/PCB, March 7/8
          High-Temperature, Pb-free Die Attach Material Project, March 22/23
 

January 2017

Download January Member Newsletter

2017 iNEMI Roadmap
    
Mining the Roadmap
iNEMI Meetings
     First Quarter Members Briefing Webinar, February 6 & 7
     iNEMI at APEX - San Diego, California
          Session S04:  Corrosion/SIR Reliability I, February 14
          Buzz Session 8:  iNEMI Roadmap Update, February 16
          iNEMI Member Meeting, February 16
     iNEMI Member Briefing in Kawasaki, Japan, February 17
Upcoming Events 
     Quarterly Member Briefing, February 6 & 7
     Member Meeting at APEX, February 16
     Member Briefing in Japan, February 17
     Fine Pitch Circuit Pattern Inspection/Metrology End-of-Project Webinar, February 20/21
     Optoelectronics TIG and Project Meetings at OFC 2017, Los Angeles, California
Featured News and Content
     iNEMI Research Webinar: Fan-Out Panel-Level Packaging, presented by Fraunhofer IZM, January 12
Projects
     New Projects in Sign-Up
          Connector Reliability Test Recommendations, Phase 2
          Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
     Three End-of-Project Webinars Scheduled
          Fine Pitch Circuit Pattern Inspection & Metrology, February 20/21
          Ultra Low Loss Laminate/PCB, March 7/8
          High-Temperature, Pb-free Die Attach Material Project, March 22/23
 


December 2016

Download December Member Newsletter

iNEMI's Year of Review
New iNEMI Members:  Senko Advanced Components

     Saki Corporation
     5N Plus
     ViTrox Technologies
iNEMI Meetings
     Meetings at APEX
          Member briefing, February 16
          2017 Roadmap presentation, February 16
          Creep Corrosion Project presentation, February 14
     Member Briefing in Kawasaki, Japan, February 17
Upcoming Events 
     iNEMI Research Webinar: Fan-out Wafer Level Packaging, presented by Fraunhofer IZM, January 12, 2017
     New Project Call for Participation Webinars
          Connector Reliability Test Recommendations, Phase 2, January 12/13
          Development of Cleanliness Specification for Expanded Beam Connectors, January 18/19
     iNEMI Sessions at IPC APEX
     iNEMI Member Briefing in Japan, February 17  
Featured News & Content
     Webinar:  Follow-up to iNEMI Forum at Electronics Goes Green
     iNEMI Research Webinar:  Developing Damage Models for Solder Joints Exposed to Complex Stress States
     End-of-Project Webinar: Value Recovery from Used Hard Disk Drives
 

November 2016

Download PDF of November Member Newsletter

New Member:  Senko Advanced Components
iNEMI Member Survey - How are we doing?
Follow-up webinar to the iNEMI Forum at EGG

Upcoming Events 
     Follow-up webinar to iNEMI Forum at EGG, November 30
     iNEMI Research Webinar: Developing Damage Models for Solder Joints Exposed to Complex Stress States: Influence of Potting, Coating, Mirroring, and Housing; presented by DfR Solutions, December 8
     End-of-Project Webinar:  Value Recovery from End-of-Life Electronics, December 14
     iNEMI Research Webinar: Fan-out Wafer Level Packaging (FOWLP), presented by Fraunhofer IZM, January 12, 2017
Projects
     Sign up for Connector Reliability Test Recommendations, Phase 2
     Sign up for Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
     End-of-Project Webinar: Value Recovery from End-of-Life Electronics
     Project Surveys Underway:
          HDD Value Recovery
          High-Temperature, Pb-free Die Attach Material
          Packaging Projects
Roadmap
     2017 iNEMI Roadmap Nearing Completion
     Integrated Photonic Systems Roadmap (IPSR)
          IPSR webinar scheduled, November 17
Featured News and Content
     Presentations
          iNEMI PCB/PCBA Seminar
          End-of-Project Webinar: Warpage Characteristics of Organic Packages, Phase 3
          End0of-Project Webinar: DC-DC Power Module Phase 2
          Q4 Member Update Webinar
          iNEMI Research Webinar:  Five-Step Methodology for Assessment of Sustainable Technologies, presented by Granta Design
          Electronic Materials for Automotive Harsh Environment, presented by Steve Payne (iNEMI) at AESIN Conference

October 2016

Download PDF of October Member Newsletter

New Board Member Named
Member Webinar Scheduled for Q4
New Member Survey - How are we doing?
iNEMI PCB/PCBA Seminar
PSMC becomes IPSR
Dues Discount Deadline is This Month

Research Webinars Scheduled
     Five-Step Methodology for Assessment of Sustainable Technologies
Upcoming Events 
     iNEMI PCB/PCBA Seminar, October 25, Taiwan
     End-of-Project Webinar:  Warpage Characteristics of Organic Packages, Phase 3, October 27-28
     End-of-Project Webinar:  DC-DC Power Module, Phase 2, October 27
     Q4 Member Webinar, October 31/November 1, November 3
     AIM Photonics Fall 2016 Meeting
     iNEMI Research Webinar, November 3
     FUTURECAR: New Era of Automotive Electronics Workshop, November 9-10
Projects
     Two Projects Report Findings in End-of-Project Webinars
          Warpage Characteristics of Organic Packages, Phase 3, October 27-28
          DC-DC Power Module, Phase 2, October 27
     We Need Your Input:  iNEMI Inspection/Metrology Survey for Fine Pitch Circuit Pattern
iNEMI Roadmap
     2017 Roadmap Nearing Completion
Featured News and Content
     Presentations
          iNEMI Forum at Electronics Goes Green 2016
          Automotive Panel at ESTC
          Medical Product Sector 2015/17 Roadmap Highlights
          Comparison of Advanced Package Warpage Measurement Metrologies
          iNEMI Presentations at SMTAI
 

September 2016

Download PDF of September Member Newsletter

Discount Offered on Membership Dues
2015 Research Priorities Published
Research Webinars Scheduled

     Assessment of the Reliability of Lead-Free Solder Joints, September 28
     Electric Cars/Buses and Magnetic Materials, November 3
Upcoming Events 
     iNEMI Presentation at IEMT-EMAP, September 21
     iNEMI Presentations at SMTAI, September 26-28
     End-of-Project Webinar:  Warpage Characteristics of Organic Packages, Phase 3, October 27-28
     FUTURECAR: New Era of Automotive Electronics Workshop, November 9-10
Projects
     Call for Participation:  Characterize and Quantify the Production Inspection Capability of the AXI of HiP Defects Project
     Call for Participation: Reuse and Recycling Metrics Project, Phase 2
     Participate in the Survey: iNEMI Inspection/Metrology Survey for Fine Pitch Circuit Pattern
     End-of-Project Webinar: Warpage Characteristics of Organic Packages, Phase 3, October 27-28
iNEMI Roadmap
     Join the iNEMI Roadmap Group on LinkedIn
Featured News and Content
     Presentations from Japan Member Meeting
     iNEMI Blog:  Improving Product Quality Through Collaborative Problem Solving


August 2016

Download PDF of August Member Newsletter

New iNEMI Member:
     Henkel
Discount Offered on Membership Dues
Events Scheduled for Q3
     iNEMI Recycling Electronics Forum at Electronics Goes Green - September 6
     Automotive Panel Roundtable:  Miniaturization & System Integration Challenges for Automotive Applications at ESTC - September 14
     iNEMI/MEPTEC/SMTA Medical Electronics Symposium 2016 - September 14-15
iNEMI Roadmap
     Site confirmed for August TWG Review Meeting
Presentations Available Online
 

July 2016

Download PDF of July Member Newsletter

New iNEMI Members:
     General Electric
     Elmatica AS
Follow us:  iNEMI Blog & LinkedIn
Webinar discusses recommendations from Substrate & Package Technology Workshop

Events Scheduled for Q3
     iNEMI Member Briefing in Japan - August 4
     iNEMI Recycling Electronics Forum at Electronics Goes Green - September 6
     Automotive Panel Roundtable:  Miniaturization & System Integration Challenges for Automotive Applications at ESTC, September 14
     iNEMI/MEPTEC/SMTA Medical Electronics Symposium 2016, September 14-15
Deployment
     End-of-Project Webinar:  Development of Cleanliness Specification for Expanded Beam Connectors
     Call for Participation Webinar:  Characterize and Quantify the Production Inspection Capability of the AXI of HiP (Head in Pillow) Defects Project
iNEMI Roadmap
     Site confirmed for August TWG Review Meeting
In the News

 

June 2016

Download PDF of June Member Newsletter

New iNEMI Members:
     Integrated Micro-Electronics Inc. (IMI)
     U.S. Department of Defense (DoD)
iNEMI Board of Directors Elections
Council of Members Meeting Report
iNEMI Substrate & Package Technology Workshop Report

     Follow-up webinars
Events Scheduled for Q3
     iNEMI Member Briefing in Japan - August 4
     iNEMI Recycling Electronics Forum at Electronics Goes Green - September 6
     Automotive Panel Roundtable:  Miniaturization & System Integration Challenges for Automotive Applications at ESTC, September 14
     Medical Electronics Symposium 2016, September 14-15
Deployment
     End-of-Project Webinar:  Development of Cleanliness Specification for Expanded Beam Connectors
iNEMI Roadmap
     2017 iNEMI Roadmap Workshops
     Site confirmed for August TWG Review Meeting
     TWG/PEG Leadership Status
Photonic Systems Manufacturing Roadmap (PSMR) Update
In the News

 

April / May 2016

Download PDF of April/May Member Newsletter

New iNEMI Members:
     CoreTech System Co., Ltd. (Moldex3D)
     St. Jude Medical
iNEMI Board of Directors Election
iNEMI Council of Members Webinar
iNEMI Substrate & Package Technology Workshop:
     "Road to Integrated SiP Package Technology Innovation"
Deployment - Call for Participation Webinars

     Final Assembly Automation and Optimization Project
     SiP Module Moldability Project
Deployment - New Projects in Sign-Up
     High-Temperature, Pb-free Die-Attach Material
     PCB/PCBA Material Characterization for Automotive Harsh Environments
     Reuse and Recycling Metrics, Phase 2
iNEMI Roadmap
     2017 iNEMI Roadmap Workshops
          North America Workshop (Las Vegas, Nevada)
          Europe Roadmap Workshop / Webinar
          Asia Roadmap Workshop / Webinar
     Site needed for August TWG Review Meeting
     TWG/PEG Leadership Changes
Photonic Systems Manufacturing Consortium (PSMC) News
Presentations now available online

 

February / March 2016

Download PDF of February/March Member Newsletter

New iNEMI Members:
     Suzhou Eunow Co., Ltd.
     Interflux Electronics N.V.
     Oak Ridge National Laboratory
Summary of Member Meeting held in Japan, hosted by Hitachi Chemical
iNEMI Substrate & Package Technology Workshop:
     "Road to Integrated SiP Package Technology Innovation"
Deployment - Meetings

     iNEMI Optoelectronics Meetings at OFC 2016
Deployment - New Initiatives
     Value Recovery from End-of-Life Electronics
     Fine Pitch Circuit Pattern Inspection/Metrology Project
     Flexible Automation/Line Integration
     Material for High-Power, High-Density PCB for Automotive Under-the-Hood Applications
Deployment - End-of-Project Webinars
     Automotive Electronic Material Challenges
     Connector Reliability Test Recommendations
iNEMI Roadmap
     Call for participation:  iNEMI Environmentally Sustainable Electronics TWG
     Summary of 2017 iNEMI Roadmap TWG Kick-off
     Site needed for August TWG Review Meeting
     TWG/PEG Leadership Changes
Presentations now available online


January 2016

Download PDF of January Member Newsletter

New iNEMI Members:
     Insidix
     TAKAOKA TOKO Co., LTD.
Research Seminar:  What is the Critical Materials Institute?
2017 Roadmap TWG Kick-off Meeting & PEG Workshop
Member Meeting in Japan, hosted by Hitachi Chemical
Deployment - New Initiatives

     Flexible Automation/Line Integration
     Material for High-Power, High-Density PCB for Automotive Under-the-Hood Applications
Deployment - Four Projects in Sign-Up
     BiSn-based Low-Temperature Soldering Process and Reliability
     Qualification Test Development for Creep Corrosion, Phase 3
     Characterize and Quantify the Production Inspection Capability of the AXI of HiP Defects
     Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program
iNEMI Roadmap
     2017 iNEMI Roadmap TWG Kick-off Scheduled for February 10-11
     Site needed for August TWG Review Meeting
     TWG Leadership Changes
Presentations now available online
 

October / November 2015

Download PDF of October/November Member Newsletter

New iNEMI Members:
     Rosenberger
     University of Waterloo
Check out our new website and update your account
Photonic Systems Manufacturing Consortium (PSMC)
     Webinars review preliminary roadmap results
     Joint Meeting of PSMC, MIT Microphotonic Center and AIM Photonics Scheduled
Deployment - New Projects in Sign-Up
     Warpage Characteristics of Organic Packages, Phase 2
     Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program
iNEMI Roadmap
     TIG Technical Plan & Research Priorities Documents
     TWG Kick-off for 2017 Roadmap Is Just Around the Corner
     New PEG added for 2017 Cycle
     PEG Leadership Changes
Presentations now available online

 

September 2015

Download PDF of September Member Newsletter

Discount Offered on Membership Dues
Japan Members' Meeting held on August 7 at Intel Japan
Fall Conferences cover medical, green and automotive electronics
2015 Medical Electronics Symposium
MSEI Open House in conjunction with Medical Electronics Symposium
Emerging Green 2015:  Electronics in a Circular Economy
iNEMI Activities at SMTA International
iNEMI/SMTA Workshop:  Electronic Material Challenges for Vehicles of the Future
Deployment
  • New Project:  Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program (Survey and Design Proposal for Test Vehicle Project)
  • End-of-Project Webinar:  MEMS Test Methods for Inertial Sensors
  • Call for Participation:  Development of Optimized Design Rules/DFM/DFT and Test Methodologies to Support HDI Technology
iNEMI Roadmap
  • Technical Plan & Research Priorities to be Published in September
  • 2017 iNEMI Roadmap Kick-off Just Around the Corner
Presentations now available online
Upcoming events

 

August 2015

Download PDF of August Member Newsletter

Discount Offered on Membership Dues
Welcome new member:  Shinko Electric America
Fall Conferences cover medical, green and automotive electronics
2015 Medical Electronics Symposium
MSEI Open House in conjunction with Medical Electronics Symposium
Emerging Green 2015:  Electronics in a Circular Economy
iNEMI Workshop:  Electronic Material Challenges for Vehicles of the Future
In Memory of David Lando
Deployment
  • Three Projects in Sign-Up
    • DC-DC Power Module, Phase 2 (Prototyping and Testing)
    • Use Environment Classification
    • Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program (Survey and Design Proposal for Test Vehicle Project)
  • Three End-of-Project Webinars Scheduled
    • Alternative Materials Assessment
    • Metals Recycling
    • MEMS Test Methods for Inertial Sensors
  • Four New Initiatives are Currently in Development or Ready to Launch
    • Bi-Sn Based Low-Temperature Solder Process and Reliability
    • Warpage Characteristics of Organic Packages, Phase 3
    • Qualification Test Development for Creep Corrosion, Phase 3
    • Quantify Impact of Board Design and Process Control on SMT Performance
iNEMI Roadmap
  • TIG Gap Analysis/Technical Plan Meetings Winding Down
  • iNEMI / ITRS Meetings at Stanford / Semicon West
  • 2017 iNEMI Roadmap Kick-off Just Around the Corner
Presentations now available online
Upcoming events
 


July 2015

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Welcome new member:  Altera Corporation
Repair and Recycling Metrics End-of-Project Webinar Scheduled
iNEMI Member Meeting in Japan on August 7
Automotive Workshop scheduled for October 5 in Germany
Deployment
  • Three Projects in Sign-Up
    • DC-DC Power Module, Phase 2 (Prototyping and Testing)
    • Use Environment Classification
    • QFN Package Board Level Reliability
  • Four New Initiative are Currently in Development or Ready to Launch
    • Warpage Characteristics of Organic Packages, Phase 3
    • Qualification Test Development for Creep Corrosion, Phase 3
    • Characterize and Quantify the Inspection Capability of AXI on HiP (Head in Pillow) Defects
    • Quantify Impact of Board Design and Process Control on SMT Performance
iNEMI Roadmap
  • TIG Gap Analysis/Technical Plan Meetings Continuing to Develop Technical Plan & Research Priorities
  • iNEMI / ITRS Meetings at Stanford / Semicon West
Presentations now available online
Upcoming events
 


May/June 2015

Download PDF of May/June 2015 Member Newsletter

Welcome new member:  Bel Power Solutions
iNEMI Member Meeting in Japan on August 7
Automotive Workshop scheduled for Fall 2015 in Europe
Deployment
  • Two End-of-Project Webinars
    • Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability, Phase 1
    • Warpage Characteristics of Organic Packages, Phase 2
  • Two Projects in Sign-Up
    • DC-DC Power Module, Phase 2 (Prototyping and Testing)
    • Use Environment Classification
  • Two Projects Starting Up
    • Semiconductor Package Miniaturization Test Vehicle for Medical Applications Initiative
    • Characterize and Quantify the Inspection Capability of the AXI on HiP (Head in Pillow) Defects Initiative
iNEMI Roadmap
  • Roadmap webinar roll-out
  • TIG Gap Analysis/Technical Plan meetings scheduled
Spring workshop held for PSMC
Presentations now available online
Upcoming events
 


April 2015

Download PDF of April 2015 Member Newsletter

Welcome new member:  UNITEC Semicondutores S/A
Nasser Grayeli to receive CPMT Award for 2015
Asia Packaging Technology Group
2015 iNEMI Research Seminar Series
Deployment
  • Call for Participation:  Semiconductor Package Miniaturization Test Vehicle for Medical Applications Initiative
iNEMI Roadmap
  • Roadmap webinar roll-out
  • TIG Gap Analysis/Technical Plan meetings scheduled
Presentations now available online
Upcoming events
 


March 2015

Download PDF of March 2015 Member Newsletter

Welcome new member:  US Conec
Three new Directors named to iNEMI Board
iNEMI Council of Members meeting
iNEMI Member meeting in Japan
Asia Packaging Technology Group
iNEMI Optoelectronics TIG and project meetings; at OFC in Los Angeles, California
iNEMI at ICEP-IAAC 2015; Kyoto, Japan
iNEMI Roadmap
  • Roadmap webinar scheduled for April 9
  • TIG Gap Analysis/Technical Plan meetings scheduled
Deployment
  • Connector project surveys
Presentations now available online
Upcoming events