Member Newsletter
November 2018
Download November Member Newsletter
NEW iNEMI HEADQUARTERS NOW OPEN IN NORTH CAROLINA
iNEMI at fall conferences
North America: SMTA International
Asia: 2018 IMPACT
Europe: Going Green - CARE INNOVATION
Projects
iNEMI Presentations at Going Green - CARE Innovation 2018 (Vienna, Austria) - November 28
End-of-Project Webinars
Reuse and Recycling Metrics End-of-Project Webinar January 23 & 24
Upcoming Events
Webinar: Packaging TIG Kick-Off Meeting — November 25/26
SEMI Smart Manufacturing Workshop – November 28 (Milpitas, California)
iNEMI Presentations at Going Green – CARE Innovation 2018 – November 28 (Vienna, Austria)
IPSR-International TWG Meetings — November 28 (MIT, Cambridge, Massachusetts, USA)
AIM Photonics Academy 2018 Fall Meeting – November 29-30 (MIT, Cambridge, Massachusetts, USA)
Green Electronics Council (GEC) Webinar: Technology for Public Health: Addressing Counterfeit Products — November 29
End-of-Project Webinar: Reuse & Recycling Metrics, Phase 2 – January 23 & 24, 2019
iNEMI Next-Generation Solder Materials Workshop at APEX 2019 — January 31, 2019 (San Diego, California, USA)
Recent Publications
Article: “Value Assessment,” Wayne Rifer, E-Scrap News, Fall 2018, pp. 58-62
Presentation: Eco-Impact Estimator, Phase 3 Call-for-Participation Webinar (October 17)
Presentation: Connector Reliability Test Recommendations, Phase 2 End-of-Project Webinar (October 17/18)
Presentation, IPSR 2018 Webinar Series: Highlights of the World Technology Mapping Forum, Prof. Ton Backx, Institute for Photonic Integration at Eindhoven University of Technology (October 18, 2018)
Presentation: Test, Inspection & Measurement TIG Overview (October 24; members only, requires log-in)
Presentation: Reuse and Recycling Metric, Phase 2 Project Summary, presented by Lisa Dender (IBM), Electronics Reuse Conference (October 29, 2018; Nashville, Tennessee)
Presentation: Value Recovery from Used Electronics, Phase 2 End-of-Project Webinar: Creating a Circular Economy for Hard Disk Drives — A Shared Vision (October 31 & November 1)
Presentation: Call-for-Participation Webinar: Packaging TIG (November 8 & 9; members only, requires log-in)
Roadmap
Roadmap Is Nearing Completion
October 2018
Download October Member Newsletter
Message from the CEO: iNEMI Headquarters is moving to North Carolina
Deadline for dues discount is October 31
iNEMI at fall conferences
North America: SMTA International
Asia: 2018 IMPACT
Europe: Going Green - CARE INNOVATION
Projects
Call for Participation Webinars
Eco-Impact Estimator, Phase 3 - October 17
Test, Inspection & Measurement TIG - October 23/24
Packaging TIG - November 8 & 9
End-of-Project Webinars
Value Recovery from Used Electronics - October 31 & November 2
Connector Reliability Test Recommendations - November 14 & 15
Upcoming Events
iNEMI Presentations at SMTA International 2018 (Rosemont, Illinois, USA) – October 15-18
Call for Participation Webinar: Eco-Impact Estimator Project, Phase 3 – October 17
IPSR Webinar: Highlights of the World Technology Mapping Forum – October 18
Call for Participation Webinar: Test, Inspection & Measurement TIG - October 23/24
2018 IMPACT - October 24-26
End-of-Project Webinar: Value Recovery, Phase 2 – October 31 & November 2
Call for Participation: Packaging TIG - November 8 & 9
End-of-Project Webinar: Connector Reliability Test Recommendations Project, Phase 2 – November 14/15
iNEMI Presentations at Going Green - CARE Innovation 2018 - November 28
Recent Publications
Presentations from iNEMI Regional Members Meeting in Japan
PCB Chat podcast, Marc Benowitz
Article: Trends in Medical Device Technology, Donald Banks (Abbott)
Webinar Presentation: Creep Corrosion Test Using iNEMI FoS Chamber
Roadmap
IPSR - Webinar Scheduled to Review Highlights of the World Technology Mapping Forum
September 2018
Download September Member Newsletter
Take advantage of membership dues discounts
New member: Tamura Corporation
Creep Corrosion: Addressing the challenge
White paper
Project report
Seminar presentations
Webinar
Upcoming Conferences
ESTC (September 18-21; Dresden, Germany)
SMTA International (October 15-18; Rosemont, Illinois, USA)
Projects
New project forming on PCBA Materials for Harsh Environments
Connector Reliability Test Recommendations team schedules end-of-project webinar
Value Recovery from Used Electronics project to report results
Eco-Impact Estimator, Phase 3 now forming
Upcoming Events
Webinar: Creep Corrosion Test Using iNEMI FoS Chamber – September 25/26
Webinar: IMAPS Directions in Advanced Packaging – October 2
iNEMI Presentations at SMTA International 2018 (Rosemont, Illinois, USA) – October 15-18
Call for Participation Webinar: Eco-Impact Estimator Project, Phase 3 – October 17
End-of-Project Webinar: Connector Reliability Test Recommendations Project, Phase 2 – October 17 & 18
IPSR Webinar: Highlights of the World Technology Mapping Forum – October 18
End-of-Project Webinar: Value Recovery, Phase 2 – October 31 & November 2
Recent Publications
Presentations from iNEMI Session at IEMT Conference
Presentation from call for participation webinar: PCBA Materials for Harsh Environments
Creep corrosion publications
Latest Blog
Mitigating Creep Corrosion with Effective Test, by Prabjit Singh (IBM)
Roadmap
Final phase is underway
August 2018
Download August Member Newsletter
Discount offered on membership dues
iNEMI session scheduled at IEMT Conference
iNEMI's Value Recovery Project recognizes Hongyue Jin
Projects
Creep Corrosion Team shares details of innovative flowers-of-sulfur test
Seminar: Mitigating Creep Corrosion with Effective Test
Webinar: Creep Corrosion Test Using iNEMI FoS Chamber
iNEMI project partners with University of Tennessee students
Test TIG schedules call for participation webinar
New project will address Reliability in Harsh Environments
End-of-Project Webinar – Connector Reliability Test Recommendations
Upcoming Events
Webinar: Test Technology Integration Group (TIG) Call for Participation — August 21
iNEMI Presentations at 38th International Electronics Manufacturing Technology (IEMT) Conference (Malaysia) – September 5
Call for Participation Webinar: PCBA Materials for Harsh Environments, Phase 2 — September 6
iNEMI Seminar: Mitigating Creep Corrosion with Effective Test (Taipei, Taiwan) – September 7
Webinar: Creep Corrosion Test Using iNEMI FoS Chamber – September 25/26
End-of-Project Webinar: Connector Reliability Test Recommendations Project, Phase 2 – October 17 & 18
Featured News & Content
Webinar: Automotive Challenges Workshop Follow-Up
End-of-Project Webinar: iNEMI-IPSR Board-Level Optical Interconnect Project
Creating a Circular Economy for Hard Disk Drives - A Shared Vision, presented by Carol Handwerker (Purdue University), 22nd Annual Green Chemistry & Engineering Conference
2017 Sustainable Electronics Roadmap, presented by Carol Handwerker (Purdue University), 22nd Annual Green Chemistry & Engineering Conference
End-of-Project Webinar: Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
Validation of Ostrom's Principles to Support Circular Economy in Used Electronics, presented by Hongyue Jin (Purdue University & University of Arizona), ISSST 2018
Integrated Photonic Systems Roadmap (IPSR) webinar series (three webinars)
Value Recovery from Hard Disk Drives, Tom Coughlin, Forbes.com
Roadmap
Technical Committee review scheduled
A glimpse of TWG roadmap updates
Engagement with SEMI
Be a part of the effort: get involved!
IPSR-International Created
July 2018
Newsletter was not published in July.
June 2018
Download June Member Newsletter
iNEMI welcomes two new members:
Cimetrix Incorporated
Sekisui Chemical Co., Ltd.
Mark your calendars: Japan Member Meeting set for August 6 in Tokyo
Projects
Webinar scheduled to report project results
Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
IPSR Activities
Paper to be presented in Europe
2018 Webinar Series: Testing Photonic Devices and Products: Status, Needs and Potential Solutions
Upcoming Events
End-of-Project Webinar: Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2 - June 20 & 21
iNEMI Presentation at International Symposium for Sustainable Systems and Technology 2018 (ISSST) - June 27
IMAPS-UK Advanced Circuit Boards Workshop - June 28
iNEMI Regional Members Meeting in Japan - August 6
Latest Publications
Presentation: Mid-Term Project Review Webinar: Value Recovery from Used Electronics, Phase 2
Article: The March 2018 issue of Optics and Photonics News featured the article, "A Roadmap for Integrated Photonics"
Roadmap
PEGs Review Progress with Technical Committee Feedback; TWGs Hold Regional Webinars
Please join us!
May 2018
Download May Member Newsletter
iNEMI welcomes three new members:
Echo Environmental
Idaho National Laboratory
ZESTRON
Creep Corrosion project's presentation receives recognition at SMTA China East
iNEMI Board of Director updates & elections
Regional roadmap webinars planned
iNEMI conference session highlights industry needs in automotive harsh environments
Projects
iNEMI survey on New Package Material Qualification Methodologies
Project in sign-up: PCBA Cleanliness
Webinars scheduled to report project results
iNEMI-IPSR Board-Level Optical Interconnect
Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
Upcoming Events
Medical Electronics Symposium - May 16-17
Roadmap Webinar: The Americas - May 29
Roadmap Webinar: EMEA (Europe, Middle East, Africa) - June 7
Automotive Challenges Workshop Follow-Up Webinar - June 12
Roadmap Webinar: APAC (Asia Pacific)
End-of-Project Webinar: iNEMI-IPSR Board-Level Optical Interconnect Project - June 13 & 14
End-of-Project Webinar: Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2 - June 20 & 21
iNEMI Presentation at International Symposium for Sustainable Systems and Technology 2018 (ISSST) - June 28
Featured News and Content
Presentation: PCBA Cleanliness Call for Participation Webinar
iNEMI Council of Members Meeting Webinar
iNEMI Session at ICEP-IAAC 2018
Presentation: iNEMI Technology Roadmap on MEMS & Sensors, presented by Haley Fu, iNEMI, FlexJapan
Read iNEMI’s latest roadmap article: “The Complicated, Expansive World of IoT: The fastest growing sector of electronics is desperate for communication standards,” Satish Parupalli (Intel) and Barbara Goldstein (NIST), Printed Circuit Design & Fab / Circuits Assembly magazine, pp 30-31, May 2018
Roadmap
Please join us!
IPSR publishes 2017 update
April 2018
Download April Member Newsletter
iNEMI welcomes new members:
COMET Group
XYLON International GmbH
Autodesk Inc.
iNEMI Board of Director updates & election
Council of Members meeting scheduled for April 18
iNEMI at conferences in Asia, Europe & North America
ICEP-IAAC 2018 - April 17-21
Electronics in Harsh Environments Conference - April 24-26
Medical Electronics Symposium 2018 - May 16-17
Projects
Wafer/Panel Level Package Flowability and Warpage - sign up by April 14
PCBA Cleanliness call for participation - April 16 & 17
Value Recovery from Used Electronics, Phase 2 mid-term project review webinar - May 9 & 10
Upcoming Events
Call for Participation Webinar: PCBA Cleanliness - April 16 & 17
iNEMI Council of Members Meeting - April 18
iNEMI Session at ICEP-IAAC 2018 - April 19
NEPCON China 2018 - April 24-26
Electronics in Harsh Environments Conference - April 24-26
Mid-Term Project Review Webinar: Value Recovery from Used Electronics - May 9 & 10
Medical Electronics Symposium - May 16-17
Featured News and Content
Presentation from call for project sign-up webinar: Wafer/Panel Level Package Flowability and Warpage
Presentations: iNEMI & AIM/IPSR Meetings at OFC 2018
The Ongoing Convergence of Gaming Devices, Kartik Ananth (Intel)
The Next PC Evolution Will Bring a Richer User Experience, Chuck Richardson (iNEMI)
AIM Photonics Webinar: What is an Application Interest Group (AIG)
End-of-project webinar presentation: SiP Module Moldability
Roadmap
Roadmap Smart Manufacturing Technology Working Group (TWG)
Product Emulator Group (PEG) progress update meetings in May
Please join us!
March 2018
Download March Member Newsletter
iNEMI welcomes two new members:
KYZEN Corporation
Momentum Technologies
Council of Members meeting scheduled for April 18
iNEMI at conferences in Asia & Europe
ICEP-IAAC 2018 - April 17-21
Electronics in Harsh Environments Conference - April 24-26
Projects
Call for Project Sign-Up Webinar: Wafer/Panel Level Package Flowability and Warpage
End-of-Project Webinar: SiP Module Moldability
Upcoming Events
Call for Project Sign-Up Webinar: Wafer/Panel Level Package Flowability and Warpage - March 14/15
AIM Photonics Webinar: What is an Application Interest Group (AIG) - March 22
End-of-Project Webinar: SiP Module Moldability - March 22 & 23
Spring 2018 IPSR Meeting - March 26-27
iNEMI Council of Members Meeting - April 18
iNEMI Session at ICEP-IAAC 2018 - April 19
NEPCON China 2018 - April 24-26
Electronics in Harsh Environments Conference - April 24-26
Medical Electronics Symposium - May 16-17
Featured News and Content
iNEMI Presentations from Pan Pacific Microelectronics Symposium
Statement of Work Overview Webinar: PCBA Cleanliness
Call for Participation: iNEMI-IPSR Board-Level Optical Interconnect, Phase 2
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
iNEMI interviews at APEX 2018
Roadmap
New from PEG Workshop & TWG Kick-Off Meeting
Be a Part of the Effort
February 2018
Download February Member Newsletter
Message from the new CEO
Join us at APEX: 2019 Roadmap Meeting - February 25 & 26
Kulicke & Soffa is newest member
iNEMI sessions at conferences in Asia, Europe, & U.S.
ICEP-IAAC 2018 - April 17-21
OFC 2018 - March 11-16
Electronics in Harsh Environments Conference - April 24-26
Projects
New Initiatives Forming
iNEMI-IPSR Board-Level Optical Interconnect, Phase 2 (Expanded-Beam Module Interface)
PCBA Cleanliness
Upcoming Events
Call for Participation: PCBA Cleanliness - February 19
Call for Participation: iNEMI-IPSR Board-Level Optical Interconnect - February 21 & 22
2019 iNEMI Roadmap PEG Workshop & TWG Kick-Off Meeting at APEX - February 25-26
iNEMI and AIM Academy Meetings at OFC 2018 - March 12
iNEMI Session at ICEP-IAAC 2018 - April 19
NEPCON China 2018 - April 24-26
Electronics in Harsh Environments Conference - April 24-26
Medical Electronics Symposium - May 16-17
Featured News and Content
Press Release: iNEMI names Marc Benowitz CEO
Presentations: iNEMI Regional Members Meeting in Japan
Presentations: iNEMI Quarterly Member Update (Q1)
Presentation: Future PCB fabrication and material requirements for the global industry segments
Roadmap
Smart Manufacturing Update
Be a Part of the Effort
January 2018
Download January Member Newsletter
iNEMI Member Meeting in Japan - January 22
iNEMI Quarterly Member Update - January 30 & 31
iNEMI Presentations at SMTA Pan Pacific - February 5-8
Projects
New Initiatives Forming
PCB/PCBA Material Characterization for Automotive Harsh Environment, Phase 2
PCBA Cleanliness
Upcoming Events
Member meeting in Japan - January 22
Webinar: Q1 Member Update - January 30 & 31
iNEMI presentation at EIPC 2018 Winter Conference - February 2
Pan Pacific Microelectronics Symposium - February 5-8
2019 iNEMI Roadmap PEG Workshop & TWG Kick-Off Meeting at APEX - February 25-26
Featured News and Content
End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3
Presentation from IPSR Webinar: Grand Challenges and Key Needs for 2018
iNEMI Roadmap: The Diversity of High-End-Systems, Dale Becker (IBM)
Roadmap
PEG Workshop & TWG Kick-Off Meeting Scheduled at APEX - February 25 & 26
A New Topic for 2019 Roadmap: Smart Manufacturing
Be a Part of the Effort
December 2017
Download December Member Newsletter
Year-End Message
New iNEMI Member
HP Inc.
IPSR Webinar: 2018 Grand Challenges & Key Needs
Meeting & Surveys
Mark Your Calendars - Q1 Member Webinar
PSMA Requests Input on Reliability Survey
New Project
Wafer/Panel Level Package Flowability and Warpage
Upcoming Events
IPSR Webinar: Grand Challenges and Key Needs for 2018 - December 21
Member meeting in Japan - January 22
Webinar: Q1 Member Update - January 30 & 31
Pan Pacific Microelectronics Symposium - February 5-8
2019 iNEMI Roadmap PEG Workshop & TWG Kick-Off Meeting at APEX - February 25-26
Featured News and Content
NextFlex Webinar: Flexible Hybrid Electronics Roadmap
iNEMI Sustainability Roadmap and Environmental Projects
Article: Recycling Storage Devices
Webinar: Q4 iNEMI Member Update
A Vision for the Circular Economy in Hard Disk Drives based on Self-Management of Common Pool Resources
Mid-Project Webinar: Reuse and Recycling, Phase 2
Qualification Test Development for Creep Corrosion, Phase 3 End-of-Project Webinar
Roadmap
2019 Roadmap PEG Workshop & TWG Kick-Off Meeting Scheduled at APEX
Recruiting PEG Leaders
November 2017
Download November Member Newsletter
New iNEMI Member
Urban Mining Company
Register today for the Q4 iNEMI Member Update
iNEMI at events in Germany this month
iNEMI Projects
New Projects in Sign-Up
Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology
Wafer/Level Package Flowability and Warpage
Upcoming Project Reports Scheduled:
Reuse and Recycling Metrics
Qualification Test Development for Creep Corrosion, Phase 3
Upcoming Events
iNEMI roadmap presentation at SMTA chapter meeting - November 11
IEEE SusTech 2017 (Phoenix, Arizona, USA) – November 12-14
Webinar: Q4 iNEMI Member Update – November 20 & 21
EcoDesign 2017 (Tainan, Taiwan) – November 29 – December 1
Mid-Project Webinar: Reuse and Recycling, Phase 2 – December 5
End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3 – December 12/13
Featured News and Content
Webinar: Knowledge Based Qualification - Meeting Challenges of New Markets and New Technologies
Call for participation presentation: Wafer/Panel Level Package Flowability and Warpage
iNEMI Session at 2017 IMPACT
Call for participation presentation: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
End-of-project webinar presentation and final report: Final Assembly Automation and Optimization
Roadmap
iNEMI Technical Plan is Available
Research Priorities Development Proceeding
PEG Work Started on 2019 Roadmap
October 2017
Download October Member Newsletter
iNEMI Technical Plan Published
Research Webinar: Knowledge-Based Qualification - Meeting Challenges of New Market and News Technologies - October 19
iNEMI Session at IMPACT 2017 (Taipei) - October 27
Deadline for Dues Discount is October 31
iNEMI Projects
Wafer/Level Package Flowability and Warpage
Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
Value Recovery from Used Electronics, Phase 2
Eco-Design Best Practices
Upcoming Project Webinars Scheduled:
Final Assembly Automation and Optimization
Reuse and Recycling Metrics
Qualification Test Development for Creep Corrosion, Phase 3
Upcoming Events
Webinar: Knowledge-Based Qualification - Meeting Challenges of New Markets and New Technologies – October 18/19
Call for Participation: Wafer/Panel Level Package Flowability and Warpage – October 25/26
iNEMI Session at 2017 IMPACT (Taipei, Taiwan) – October 27
Call for Participation: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2 – October 31 & November 1
End-of-Project Webinar: Final Assembly Automation & Optimization – November 2
FUTURECAR 2017 (Atlanta, Georgia, USA) – November 8-10
IEEE SusTech 2017 (Phoenix, Arizona, USA) – November 12-14
Webinar: Q4 iNEMI Member Update – November 20 & 21
EcoDesign 2017 (Tainan, Taiwan) – November 29 – December 1
Mid-Project Webinar: Reuse and Recycling, Phase 2 – December 5
End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3 – December 12/13
Featured News and Content
Presentation: Roadmap Webinar: Board Assembly Chapter
Presentation: Eco-Design Best Practices Project Call for Participation Webinar
Presentation: SMTAI Luncheon Keynote – 2017 iNEMI Roadmap Highlights Impacting Board Assembly Over the Next 5-10 Years, Bill Bader (iNEMI)
iNEMI presentations at SMTA International (Rosemont/Chicago, Illinois, USA)
Presentation: Highlights of iNEMI 2017 Roadmap; presented by Steve Payne (iNEMI), ICT-Institute of Circuit Technology (Hayling Island, United Kingdom)
Presentation: Results from Polymer Outgassing Metrology Survey (iNEMI webinar)
Press interviews at SMTA International
Roadmap
Research Priorities Development Proceeding
2019 Roadmap Cycle Launched
September 2017
Download September Member Newsletter
iNEMI Welcomes Linda Wilson as New Roadmap Manager
iNEMI Webinar: Board Assembly Roadmap
Polymer Outgassing Metrology Survey Results - September 20
Take Advantage of Discount on Membership Dues
Fall Conferences
SMTAI
IMPACT 2017
iNEMI Projects
Value Recovery from Used Electronics, Phase 2
Eco-Design Best Practices
Upcoming Events
iNEMI Roadmap Webinar - Board Assembly - September 13
Call for Participation Webinar: Eco-Design Best Practices Project - September 13 & 14
iNEMI at SMTAI - September 17-21
Electronics Packaging Symposium - September 19-20
Webinar: Results from Polymer Outgassing Metrology Survey - September 20
Fall 2017 IPSR Meeting
iNEMI Session at 2017 IMPACT
FUTURECAR 2017 - November 8-10
IEEE SusTech 2017 - November 12-14
Webinar: Q4 iNEMI Member Update - November 20 & 21
Featured News and Content
Press Release: iNEMI Names New Roadmap Manager
Presentation: iNEMI Regional Member Meeting in Japan
Presentation: Q3 iNEMI Member Update Webinar
Presentation: Packaging & Component Substrates Roadmap Webinar
Presentation: PCB/PCBA Material Characterization for Automotive Harsh Environments End-of Project Webinar
New from the iNEMI Blog
Flexible Hybrid Electronics Key to a Personalized Digital Future, by Daniel Gamota (Jabil)
Roadmap
iNEMI Technical Plan Nearing Completion
Research Priorities Development Proceeding
August 2017
Download August Member Newsletter
Discount Offered on Membership Dues
Quarterly Member Update - August 29
Automotive Project Publishes Report, Schedules Webinar
Fall Conferences
SMTAI
IMPACT 2017
iNEMI Projects
Value Recovery from Used Electronics, Phase 2
New Packaging Technology Qualification Methodology
Warpage Characteristics of Organic Packages, Phase 4
Upcoming Events
IPSR Webinar Series:
Integrated Photonic Sensors Manufacturing - August 10
Assembly Processes - August 24
Q3 iNEMI Member Update Webinar, August 28 & 29
iNEMI Roadmap Webinar: Packaging & Component Substrates - August 30
Call for Participation: Value Recovery from Used Electronics, Phase 2
End-of-Project Webinar: PCB/PCBA Material Characterization for Automotive Harsh Environments - September 7
iNEMI Roadmap Webinar- September 13
iNEMI at SMTAI - September 17-21
iNEMI Session at 2017 IMPACT
FUTURECAR - November 8-10
New from the iNEMI Blog
Packaging Innovation Maintains the Pace of Progress as Moore's Law Scaling Slows, W.R. (Bill) Bottoms
Roadmap
Chapter-Focused Webinars Planned
Packaging & Component Substrates - August 30
Board Assembly - September 13
iNEMI Technical Plan Progresses
Research Priorities Development Meeting Held in July
July 2017
Download July Member Newsletter
iNEMI Member Meeting in Tokyo - August 4
Quarterly Member Update - August 29
William Chen Receives IEEE Award
We Need Your Input: Survey to Assess Polymer Outgassing Metrology
iNEMI Projects
New Packaging Technology Qualification Methodology
PCB Warpage Characterization & Minimization Project
Warpage Characteristics of Organic Packages, Phase 4
End-of-Project Webinar: Electronic Materials for Automotive Harsh Environments
Featured News and Content
Presentation: A Vision for the Circular Economy in Hard Disk Drives Based on Self-Management of Common Pool Resources, presented by Colin Fitzpatrick, at ISIE-ISSST (June 29; Chicago)
Presentation: iNEMI Roadmap 2017, presented by Alan Rae at the International Conference on Soldering & Reliability (Toronto; June 7).
New from the iNEMI Blog
Mass Data Storage Roadmap Points to Further Growth in NAND as well as HDD, Tape and Optical Technologies, by Roger F. Hoyt
Upcoming Events
Call for Participation Webinar: Warpage Characteristics or Organic Packages, July 27 & 28
iNEMI Member Meeting in Tokyo - August 4
Q3 iNEMI Member Update Webinar, August 28 & 29
End-of-Project Webinar: Electronic Materials for Automotive Harsh Environments - September 7
iNEMI at SMTAI - September 17-21
iNEMI Session at 2017 IMPACT
Roadmap
TIGs Continue Work on iNEMI Technical Plan
June 2017
Download June Member Newsletter
New iNEMI Member
Critical Materials Institute (CMI)
Board of Directors Election Results
We Need Your Input: Survey to Assess Polymer Outgassing Metrology
iNEMI Projects
iNEMI-IPSR Board-Level Optical Interconnect Project
PCB Warpage Characterization & Minimization Project
Featured News and Content
Presentations: Q2 iNEMI Members Webinar, May 8 & 9
Presentations: iNEMI Session at ICEP; Yamagata, Japan, April 20
Presentation: Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards, June 2017
Upcoming Events
Call for Participation Webinar: PCB Warpage Characterization and Minimization, June 14 & 15
iNEMI Presentation at 2017 Joint Conference ISIE and ISSST, Chicago, Illinois, June 29
Q4 iNEMI Member Update Webinar, August 28 & 29
Roadmap
Five of Seven TIGs Up and Running as Work on Technical Plan Progresses
May 2017
Download May Member Newsletter
New iNEMI Member
Silicon Valley X-Ray Inc. (SVXR)
Q2 Member Update Webinar (May 9)
iNEMI Projects
iNEMI-IPSR Board-Level Optical Interconnect Project
Featured News and Content
Presentations: 2017 Roadmap Highlights Webinars (April 6 & 7)
Presentations: iNEMI & CDCC Workshop: Corrosion in Data and Telecom Centers (April 24; Shanghai, China)
Presentation: Highlights of the Passives Chapter from the 2017 iNEMI Roadmap, Chuck Richardson (iNEMI), Electronic Components Industry Association (ECIA) Spring Engineering Summit (May 3; Herndon, Virginia)
Upcoming Events
Q2 iNEMI Member Update Webinar, May 8/9
R2i-2017 Innovation Workshop, Dublin, Ireland, May 18
iNEMI Presentation at 2017 Joint Conference ISIE and ISSST, Chicago, Illinois, June 29
iNEMI Presentation at Toronto Expo & Tech Forum, co-located with International Conference on Soldering & Reliability, Markham, Ontario, June 7
Roadmap
Additional Chapters and Full Roadmap Published
TIGs Developing iNEMI Technology Plan
April 2017
Download April Member Newsletter
iNEMI Welcomes Three New Members
METech Recycling
Pegatron Corporation
Shenmao Technology Inc.
Value Recovery Report Published
iNEMI Projects
iNEMI-IPSR Board-Level Optical Interconnect Project
Approaches to Minimize PCB Warpage in Board Assembly Process to Improve SMT Yield
Upcoming Events
iNEMI Session at ICEP Conference, Yamagata, Japan, April 20
iNEMI & CDCC Workshop, Shanghai, China, April 24
Q2 iNEMI Member Update Webinar, May 8/9
R2i-2017 Innovation Workshop, Dublin, Ireland, May 18
iNEMI Presentation at 2017 Joint Conference ISIE and ISSST, Chicago, Illinois, June 25-29
Sign Up Today: Q2 Member Update (May 8/9)
Featured News and Content
Keynote: Packaging Trends and Challenges, 2017 IMAPS-UK Microtech, March 16
Value Recovery Project Report, April 2017
iNEMI Optoelectronics TIG and Project Meetings at OFC 2017, March 20
End-of-Project Webinar: High-Temperature, Pb-Free Die Attach Material Project, Phase 1, March 23
Latest Blog Post: IoT is a Revolutionary Force in Many Areas
Roadmap
Additional Roadmap Chapters Published - Available Online for Members
March 2017
Download March Member Newsletter
iNEMI Welcomes Tin Products Manufacturing Company
Nominations for iNEMI Board of Directors
Get Involved: iNEMI TIGs and Technical Plan
Presentations from iNEMI Member Meeting in Japan
Integrated Photonics
Integrated Photonic Systems Roadmap Available
Upcoming Events
AIM Photonics Spring 2017 Meeting, Cambridge, Massachusetts, March 28-29
iNEMI Session at ICEP Conference, Yamagata, Japan, April 20
iNEMI & CDCC Workshop, Shanghai, China, April 24
Save the Date
Make plans to join us for the 2017 iNEMI Roadmap Webinar, April 6-7
Meetings in Asia
ICEP 2017 Conference, Yamagata, Japan, April 20
iNEMI & CDCC Workshop, Shanghai, China, April 24
Featured News and Content
End-of-Project Webinar Presentation: Fine Pitch Circuit Pattern Inspection Metrology, February 21
End-of-Project Webinar Presentation: Ultra Low Loss Laminate-PCB, March 7/8
APEX 2017 Presentations
iNEMI Projects
New Project: Approaches to Minimize PCB Warpage in Board Assembly Process to Improve SMT Yield
End-of-Project Webinar: High Temperature, Pb-free Die Attach Material Project, March 22/23
February 2017
Download February Member Newsletter
Roadmap Webinars Set
Get Involved: iNEMI TIGs and Technical Plan
Integrated Photonics
Integrated Photonic Systems Roadmap
IPSR Consortial Projects
Upcoming Events
Keynote presentation, MicroTech 2017 (UK), March 16
iNEMI Optoelectronics TIG and Project Meetings at OFC 2017, Los Angeles, California, March 20
IPSR Meetings at OFC 2017, Los Angeles, California, March 19-21
Webinar: Highlights of 2017 iNEMI Roadmap, April 6 & 7
iNEMI Session at ICEP Conference, Yamagata, Japan, April 20
AIM Photonics Spring 2017 Meeting, Cambridge Massachusetts, March 28-29
Save the Date for Quarterly Member Webinars
Q2: May 8 & 9
Q3: August 28 & 29
Q4: November 20 & 21
Featured News and Content
Presentations from iNEMI's First Quarter Member Webinar, February 6 & 7
Latest blog post: Building a Circular Economy in the Electronics Industry
iNEMI Projects
Three End-of-Project Webinars Scheduled
Fine Pitch Circuit Pattern Inspection & Metrology, February 20/21
Ultra Low Loss Laminate/PCB, March 7/8
High-Temperature, Pb-free Die Attach Material Project, March 22/23
January 2017
Download January Member Newsletter
2017 iNEMI Roadmap
Mining the Roadmap
iNEMI Meetings
First Quarter Members Briefing Webinar, February 6 & 7
iNEMI at APEX - San Diego, California
Session S04: Corrosion/SIR Reliability I, February 14
Buzz Session 8: iNEMI Roadmap Update, February 16
iNEMI Member Meeting, February 16
iNEMI Member Briefing in Kawasaki, Japan, February 17
Upcoming Events
Quarterly Member Briefing, February 6 & 7
Member Meeting at APEX, February 16
Member Briefing in Japan, February 17
Fine Pitch Circuit Pattern Inspection/Metrology End-of-Project Webinar, February 20/21
Optoelectronics TIG and Project Meetings at OFC 2017, Los Angeles, California
Featured News and Content
iNEMI Research Webinar: Fan-Out Panel-Level Packaging, presented by Fraunhofer IZM, January 12
Projects
New Projects in Sign-Up
Connector Reliability Test Recommendations, Phase 2
Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
Three End-of-Project Webinars Scheduled
Fine Pitch Circuit Pattern Inspection & Metrology, February 20/21
Ultra Low Loss Laminate/PCB, March 7/8
High-Temperature, Pb-free Die Attach Material Project, March 22/23
December 2016
Download December Member Newsletter
iNEMI's Year of Review
New iNEMI Members: Senko Advanced Components
Saki Corporation
5N Plus
ViTrox Technologies
iNEMI Meetings
Meetings at APEX
Member briefing, February 16
2017 Roadmap presentation, February 16
Creep Corrosion Project presentation, February 14
Member Briefing in Kawasaki, Japan, February 17
Upcoming Events
iNEMI Research Webinar: Fan-out Wafer Level Packaging, presented by Fraunhofer IZM, January 12, 2017
New Project Call for Participation Webinars
Connector Reliability Test Recommendations, Phase 2, January 12/13
Development of Cleanliness Specification for Expanded Beam Connectors, January 18/19
iNEMI Sessions at IPC APEX
iNEMI Member Briefing in Japan, February 17
Featured News & Content
Webinar: Follow-up to iNEMI Forum at Electronics Goes Green
iNEMI Research Webinar: Developing Damage Models for Solder Joints Exposed to Complex Stress States
End-of-Project Webinar: Value Recovery from Used Hard Disk Drives
November 2016
Download PDF of November Member Newsletter
New Member: Senko Advanced Components
iNEMI Member Survey - How are we doing?
Follow-up webinar to the iNEMI Forum at EGG
Upcoming Events
Follow-up webinar to iNEMI Forum at EGG, November 30
iNEMI Research Webinar: Developing Damage Models for Solder Joints Exposed to Complex Stress States: Influence of Potting, Coating, Mirroring, and Housing; presented by DfR Solutions, December 8
End-of-Project Webinar: Value Recovery from End-of-Life Electronics, December 14
iNEMI Research Webinar: Fan-out Wafer Level Packaging (FOWLP), presented by Fraunhofer IZM, January 12, 2017
Projects
Sign up for Connector Reliability Test Recommendations, Phase 2
Sign up for Development of Cleanliness Specification for Expanded Beam Connectors, Phase 2
End-of-Project Webinar: Value Recovery from End-of-Life Electronics
Project Surveys Underway:
HDD Value Recovery
High-Temperature, Pb-free Die Attach Material
Packaging Projects
Roadmap
2017 iNEMI Roadmap Nearing Completion
Integrated Photonic Systems Roadmap (IPSR)
IPSR webinar scheduled, November 17
Featured News and Content
Presentations
iNEMI PCB/PCBA Seminar
End-of-Project Webinar: Warpage Characteristics of Organic Packages, Phase 3
End0of-Project Webinar: DC-DC Power Module Phase 2
Q4 Member Update Webinar
iNEMI Research Webinar: Five-Step Methodology for Assessment of Sustainable Technologies, presented by Granta Design
Electronic Materials for Automotive Harsh Environment, presented by Steve Payne (iNEMI) at AESIN Conference
October 2016
Download PDF of October Member Newsletter
New Board Member Named
Member Webinar Scheduled for Q4
New Member Survey - How are we doing?
iNEMI PCB/PCBA Seminar
PSMC becomes IPSR
Dues Discount Deadline is This Month
Research Webinars Scheduled
Five-Step Methodology for Assessment of Sustainable Technologies
Upcoming Events
iNEMI PCB/PCBA Seminar, October 25, Taiwan
End-of-Project Webinar: Warpage Characteristics of Organic Packages, Phase 3, October 27-28
End-of-Project Webinar: DC-DC Power Module, Phase 2, October 27
Q4 Member Webinar, October 31/November 1, November 3
AIM Photonics Fall 2016 Meeting
iNEMI Research Webinar, November 3
FUTURECAR: New Era of Automotive Electronics Workshop, November 9-10
Projects
Two Projects Report Findings in End-of-Project Webinars
Warpage Characteristics of Organic Packages, Phase 3, October 27-28
DC-DC Power Module, Phase 2, October 27
We Need Your Input: iNEMI Inspection/Metrology Survey for Fine Pitch Circuit Pattern
iNEMI Roadmap
2017 Roadmap Nearing Completion
Featured News and Content
Presentations
iNEMI Forum at Electronics Goes Green 2016
Automotive Panel at ESTC
Medical Product Sector 2015/17 Roadmap Highlights
Comparison of Advanced Package Warpage Measurement Metrologies
iNEMI Presentations at SMTAI
September 2016
Download PDF of September Member Newsletter
Discount Offered on Membership Dues
2015 Research Priorities Published
Research Webinars Scheduled
Assessment of the Reliability of Lead-Free Solder Joints, September 28
Electric Cars/Buses and Magnetic Materials, November 3
Upcoming Events
iNEMI Presentation at IEMT-EMAP, September 21
iNEMI Presentations at SMTAI, September 26-28
End-of-Project Webinar: Warpage Characteristics of Organic Packages, Phase 3, October 27-28
FUTURECAR: New Era of Automotive Electronics Workshop, November 9-10
Projects
Call for Participation: Characterize and Quantify the Production Inspection Capability of the AXI of HiP Defects Project
Call for Participation: Reuse and Recycling Metrics Project, Phase 2
Participate in the Survey: iNEMI Inspection/Metrology Survey for Fine Pitch Circuit Pattern
End-of-Project Webinar: Warpage Characteristics of Organic Packages, Phase 3, October 27-28
iNEMI Roadmap
Join the iNEMI Roadmap Group on LinkedIn
Featured News and Content
Presentations from Japan Member Meeting
iNEMI Blog: Improving Product Quality Through Collaborative Problem Solving
August 2016
Download PDF of August Member Newsletter
New iNEMI Member:
Henkel
Discount Offered on Membership Dues
Events Scheduled for Q3
iNEMI Recycling Electronics Forum at Electronics Goes Green - September 6
Automotive Panel Roundtable: Miniaturization & System Integration Challenges for Automotive Applications at ESTC - September 14
iNEMI/MEPTEC/SMTA Medical Electronics Symposium 2016 - September 14-15
iNEMI Roadmap
Site confirmed for August TWG Review Meeting
Presentations Available Online
July 2016
Download PDF of July Member Newsletter
New iNEMI Members:
General Electric
Elmatica AS
Follow us: iNEMI Blog & LinkedIn
Webinar discusses recommendations from Substrate & Package Technology Workshop
Events Scheduled for Q3
iNEMI Member Briefing in Japan - August 4
iNEMI Recycling Electronics Forum at Electronics Goes Green - September 6
Automotive Panel Roundtable: Miniaturization & System Integration Challenges for Automotive Applications at ESTC, September 14
iNEMI/MEPTEC/SMTA Medical Electronics Symposium 2016, September 14-15
Deployment
End-of-Project Webinar: Development of Cleanliness Specification for Expanded Beam Connectors
Call for Participation Webinar: Characterize and Quantify the Production Inspection Capability of the AXI of HiP (Head in Pillow) Defects Project
iNEMI Roadmap
Site confirmed for August TWG Review Meeting
In the News
June 2016
Download PDF of June Member Newsletter
New iNEMI Members:
Integrated Micro-Electronics Inc. (IMI)
U.S. Department of Defense (DoD)
iNEMI Board of Directors Elections
Council of Members Meeting Report
iNEMI Substrate & Package Technology Workshop Report
Follow-up webinars
Events Scheduled for Q3
iNEMI Member Briefing in Japan - August 4
iNEMI Recycling Electronics Forum at Electronics Goes Green - September 6
Automotive Panel Roundtable: Miniaturization & System Integration Challenges for Automotive Applications at ESTC, September 14
Medical Electronics Symposium 2016, September 14-15
Deployment
End-of-Project Webinar: Development of Cleanliness Specification for Expanded Beam Connectors
iNEMI Roadmap
2017 iNEMI Roadmap Workshops
Site confirmed for August TWG Review Meeting
TWG/PEG Leadership Status
Photonic Systems Manufacturing Roadmap (PSMR) Update
In the News
April / May 2016
Download PDF of April/May Member Newsletter
New iNEMI Members:
CoreTech System Co., Ltd. (Moldex3D)
St. Jude Medical
iNEMI Board of Directors Election
iNEMI Council of Members Webinar
iNEMI Substrate & Package Technology Workshop:
"Road to Integrated SiP Package Technology Innovation"
Deployment - Call for Participation Webinars
Final Assembly Automation and Optimization Project
SiP Module Moldability Project
Deployment - New Projects in Sign-Up
High-Temperature, Pb-free Die-Attach Material
PCB/PCBA Material Characterization for Automotive Harsh Environments
Reuse and Recycling Metrics, Phase 2
iNEMI Roadmap
2017 iNEMI Roadmap Workshops
North America Workshop (Las Vegas, Nevada)
Europe Roadmap Workshop / Webinar
Asia Roadmap Workshop / Webinar
Site needed for August TWG Review Meeting
TWG/PEG Leadership Changes
Photonic Systems Manufacturing Consortium (PSMC) News
Presentations now available online
February / March 2016
Download PDF of February/March Member Newsletter
New iNEMI Members:
Suzhou Eunow Co., Ltd.
Interflux Electronics N.V.
Oak Ridge National Laboratory
Summary of Member Meeting held in Japan, hosted by Hitachi Chemical
iNEMI Substrate & Package Technology Workshop:
"Road to Integrated SiP Package Technology Innovation"
Deployment - Meetings
iNEMI Optoelectronics Meetings at OFC 2016
Deployment - New Initiatives
Value Recovery from End-of-Life Electronics
Fine Pitch Circuit Pattern Inspection/Metrology Project
Flexible Automation/Line Integration
Material for High-Power, High-Density PCB for Automotive Under-the-Hood Applications
Deployment - End-of-Project Webinars
Automotive Electronic Material Challenges
Connector Reliability Test Recommendations
iNEMI Roadmap
Call for participation: iNEMI Environmentally Sustainable Electronics TWG
Summary of 2017 iNEMI Roadmap TWG Kick-off
Site needed for August TWG Review Meeting
TWG/PEG Leadership Changes
Presentations now available online
January 2016
Download PDF of January Member NewsletterNew iNEMI Members:
Insidix
TAKAOKA TOKO Co., LTD.
Research Seminar: What is the Critical Materials Institute?
2017 Roadmap TWG Kick-off Meeting & PEG Workshop
Member Meeting in Japan, hosted by Hitachi Chemical
Deployment - New Initiatives
Flexible Automation/Line Integration
Material for High-Power, High-Density PCB for Automotive Under-the-Hood Applications
Deployment - Four Projects in Sign-Up
BiSn-based Low-Temperature Soldering Process and Reliability
Qualification Test Development for Creep Corrosion, Phase 3
Characterize and Quantify the Production Inspection Capability of the AXI of HiP Defects
Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program
iNEMI Roadmap
2017 iNEMI Roadmap TWG Kick-off Scheduled for February 10-11
Site needed for August TWG Review Meeting
TWG Leadership Changes
Presentations now available online
October / November 2015
Download PDF of October/November Member NewsletterNew iNEMI Members:
Rosenberger
University of Waterloo
Check out our new website and update your account
Photonic Systems Manufacturing Consortium (PSMC)
Webinars review preliminary roadmap results
Joint Meeting of PSMC, MIT Microphotonic Center and AIM Photonics Scheduled
Deployment - New Projects in Sign-Up
Warpage Characteristics of Organic Packages, Phase 2
Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program
iNEMI Roadmap
TIG Technical Plan & Research Priorities Documents
TWG Kick-off for 2017 Roadmap Is Just Around the Corner
New PEG added for 2017 Cycle
PEG Leadership Changes
Presentations now available online
September 2015
Download PDF of September Member NewsletterDiscount Offered on Membership Dues
Japan Members' Meeting held on August 7 at Intel Japan
Fall Conferences cover medical, green and automotive electronics
2015 Medical Electronics Symposium
MSEI Open House in conjunction with Medical Electronics Symposium
Emerging Green 2015: Electronics in a Circular Economy
iNEMI Activities at SMTA International
iNEMI/SMTA Workshop: Electronic Material Challenges for Vehicles of the Future
Deployment
- New Project: Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program (Survey and Design Proposal for Test Vehicle Project)
- End-of-Project Webinar: MEMS Test Methods for Inertial Sensors
- Call for Participation: Development of Optimized Design Rules/DFM/DFT and Test Methodologies to Support HDI Technology
- Technical Plan & Research Priorities to be Published in September
- 2017 iNEMI Roadmap Kick-off Just Around the Corner
Upcoming events
August 2015
Download PDF of August Member NewsletterDiscount Offered on Membership Dues
Welcome new member: Shinko Electric America
Fall Conferences cover medical, green and automotive electronics
2015 Medical Electronics Symposium
MSEI Open House in conjunction with Medical Electronics Symposium
Emerging Green 2015: Electronics in a Circular Economy
iNEMI Workshop: Electronic Material Challenges for Vehicles of the Future
In Memory of David Lando
Deployment
- Three Projects in Sign-Up
- DC-DC Power Module, Phase 2 (Prototyping and Testing)
- Use Environment Classification
- Semiconductor Package Miniaturization Test Vehicle for Medical Applications Program (Survey and Design Proposal for Test Vehicle Project)
- Three End-of-Project Webinars Scheduled
- Alternative Materials Assessment
- Metals Recycling
- MEMS Test Methods for Inertial Sensors
- Four New Initiatives are Currently in Development or Ready to Launch
- Bi-Sn Based Low-Temperature Solder Process and Reliability
- Warpage Characteristics of Organic Packages, Phase 3
- Qualification Test Development for Creep Corrosion, Phase 3
- Quantify Impact of Board Design and Process Control on SMT Performance
- TIG Gap Analysis/Technical Plan Meetings Winding Down
- iNEMI / ITRS Meetings at Stanford / Semicon West
- 2017 iNEMI Roadmap Kick-off Just Around the Corner
Upcoming events
July 2015
Download PDF of July Member NewsletterWelcome new member: Altera Corporation
Repair and Recycling Metrics End-of-Project Webinar Scheduled
iNEMI Member Meeting in Japan on August 7
Automotive Workshop scheduled for October 5 in Germany
Deployment
- Three Projects in Sign-Up
- DC-DC Power Module, Phase 2 (Prototyping and Testing)
- Use Environment Classification
- QFN Package Board Level Reliability
- Four New Initiative are Currently in Development or Ready to Launch
- Warpage Characteristics of Organic Packages, Phase 3
- Qualification Test Development for Creep Corrosion, Phase 3
- Characterize and Quantify the Inspection Capability of AXI on HiP (Head in Pillow) Defects
- Quantify Impact of Board Design and Process Control on SMT Performance
- TIG Gap Analysis/Technical Plan Meetings Continuing to Develop Technical Plan & Research Priorities
- iNEMI / ITRS Meetings at Stanford / Semicon West
Upcoming events
May/June 2015
Download PDF of May/June 2015 Member NewsletterWelcome new member: Bel Power Solutions
iNEMI Member Meeting in Japan on August 7
Automotive Workshop scheduled for Fall 2015 in Europe
Deployment
- Two End-of-Project Webinars
- Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability, Phase 1
- Warpage Characteristics of Organic Packages, Phase 2
- Two Projects in Sign-Up
- DC-DC Power Module, Phase 2 (Prototyping and Testing)
- Use Environment Classification
- Two Projects Starting Up
- Semiconductor Package Miniaturization Test Vehicle for Medical Applications Initiative
- Characterize and Quantify the Inspection Capability of the AXI on HiP (Head in Pillow) Defects Initiative
- Roadmap webinar roll-out
- TIG Gap Analysis/Technical Plan meetings scheduled
Presentations now available online
Upcoming events
April 2015
Download PDF of April 2015 Member NewsletterWelcome new member: UNITEC Semicondutores S/A
Nasser Grayeli to receive CPMT Award for 2015
Asia Packaging Technology Group
2015 iNEMI Research Seminar Series
Deployment
- Call for Participation: Semiconductor Package Miniaturization Test Vehicle for Medical Applications Initiative
- Roadmap webinar roll-out
- TIG Gap Analysis/Technical Plan meetings scheduled
Upcoming events
March 2015
Download PDF of March 2015 Member NewsletterWelcome new member: US Conec
Three new Directors named to iNEMI Board
iNEMI Council of Members meeting
iNEMI Member meeting in Japan
Asia Packaging Technology Group
iNEMI Optoelectronics TIG and project meetings; at OFC in Los Angeles, California
iNEMI at ICEP-IAAC 2015; Kyoto, Japan
iNEMI Roadmap
- Roadmap webinar scheduled for April 9
- TIG Gap Analysis/Technical Plan meetings scheduled
- Connector project surveys
Presentations now available online
Upcoming events