Pb-Free Nano-Solder Project
Chair: Andrew Skipor (Motorola, Inc.)
End of Project Webinar: iNEMI Nano-Solder Project (February 4, 2009) (iNEMI members only)
This iNEMI research project is investigating the application of nanotechnology to suppress Pb-free solder reflow temperature. Pb-free materials and products require the use of solders that have higher melting points and, therefore, require higher processing temperatures than SnPb solder. These higher reflow temperatures can negatively affect product reliability, require tougher qualification requirements for components, and sometimes result in significant changes in manufacturing processes.
Nanotechnology encompasses many diverse disciplines to allow the manipulation of matter at the atomic level, enabling radical new approaches to material property enhancement and synthesis. Researchers have demonstrated that nano-scale metal tin particles have a melting temperature that is more than 70°C below the melting point of bulk tin. Work in this area has shown that melting point depends on particle size as the diameter approaches the sub-20 nanometer range.
The goal of the iNEMI Pb-Free Nano-Solder Project is to research and develop a nano-solder paste that can effectively suppress the melting point temperature of Pb-free solders. The team plans to demonstrate the feasibility of such a solution, and to demonstrate manufacturability and joint reliability. The project is planned as a four-phase effort:
(1) Research, develop, and demonstrate a nano-solder paste
(2) Demonstrate manufacturability
(3) Demonstrate joint reliability
(4) Develop/demonstrate manufacturing equipment
To date, the project team has demonstrated the ability to produce nano-particles of tin and confirmed a melting point depression on these particles.
Statement of Work, v 5.0 (June 30, 2005)
Project Statement, v 3.0 (June 30, 2005)