Chair: Houssam Jomaa, Intel Corporation
Co-Chair: Richard Coyle, Alcatel-Lucent
The transition to Pb-free solder alloys introduces new concerns regarding solder joint reliability. The implementation of alternative surface finishes for circuit boards and package substrates/leadframes compounds these reliability concerns. Although multiple studies are investigating the impact of Pb-free solder and alternative board finishes on board-level temperature cycling lifetime, few studies have dealt with the impact of these new material sets on solder joint reliability.
Scope of Work:
Comparative reliability testing will be conducted on Pb-free components assembled on test boards. Test board assemblies will be configured to evaluate multiple component surface finishes and 2 circuit board surface finishes. The reliability testing will be conducted with mechanical testing - with and without aging. Mechanical testing will consist of 4-point monotonic bend testing (IPC/JEDEC-9702) and drop testing.
The component surface finishes to be evaluated are listed below: