Board Flexure Standardization, Phase 2

Chair:
Elizabeth
Benedetto, HP

Co-chair:
Radhakrishnan
Jagadeesh, Intel

 

End-of-Project Webinar

  • Presentation (August 4, 2015)
  • This presentation is for iNEMI members only.

Project Objective

To develop recommendations to update IPC/JEDEC 9704 to reflect current best practices in strain gage technologies and measurement techniques.

Statement of Work and Project Statement

Board Flexure Standardization, Phase 2 (Guidelines for Printed Wiring Board Strain Gage Testing in Pb-Free Assemblies)

For Additional Information

David Godlewski
+1 717-651-0522
dgodlewski@inemi.org