Advancing Manufacturing Technology

Automotive Electronic Material Challenges

Co-chair:
Anitha Sinkfield (Delphi)



Co-Chair: Anil Kurella (Intel)
 

End-of-Project Webinar

  • Presentation (March 17, 2015)
  • Recording (35 mins)
  • The presentation and recording are available to both iNEMI members and to industry
  • The team discussed our work on material challenges in the passenger compartment, primarily focusing on thermal interface materials.

Project Statement and Statement of Work

Background

Automobiles are incorporating more and more electronics from various industry sectors that have not been optimally designed for use inside the passenger compartment. The conditions therein include thermal cycles, shock, vibration and heat aging with reliability expectations beyond typical consumer electronics (10–20 years).
 
The drive for miniaturization coupled with automotive reliability expectations requires better understanding of material properties beyond standard bulk analysis.
 
Consumer electronics (e.g., cameras, capacitive touch, curved displays) are moving into the automotive space and are not really designed for the passenger compartment environment (e,g., thermal cycling, humidity, S+V...)
  • Issue is “under testing” or under designed for automotive (reliability issues).
Some higher end use electronics (radar, GPS/Navigation) from military-level applications are moving into non-military automotive vehicles as well.
  • Issue is “over testing” or over designed for automotive (cost issues).

Project Objectives

We will measure functional performance of small geometries through understanding a combination of material properties and interface properties. Gaps and recommendations will be identified and closed, where possible in the project timeframe.
 
The end goal is to have the necessary information to predict reliability of technology to reduce design cycles.  This would optimize reliability and reduce costs for the industry as a whole.

Project Focus

  • Identify dominant failure mechanisms in automotive electronics
    • Utilize the DFMEA approach and publish the generic FMEA
    • E.g., Heat // Vibration // Contamination //mechanical load // moisture exposure…
  • Identify particular materials categories to focus project
  • Prioritize key properties for predictive modeling of reliability and performance
  • Publish a report where we identify tests and test methodologies for selected materials
    • E.g., how would we measure or predict the tensile strength of a 0.5mm solder ball; plug-in USB port reliability; camera connections/flex cables
  • Identify existing models
  • This may result in recommendations for developing test methods as a follow-on project

Presentations

Automotive Electronic Material Challenges, Anitha Sinkfield, Delphi, IMAPS Automotive Microelectronics and Packaging Conference (June 3-4, 2015; Dearborn, MI)

iNEMI Project on Automotive Electronic Material Challenges, presented by Jeffrey Lee, IST, ICEPT 2015, August 11-14, 2015, Changsha, China

Presentation from Call for Participation Webinars

For Additional Information

Mark Schaffer